Home > New Products > BERGQUIST® GAP PAD® TGP 800VO

BERGQUIST® GAP PAD® TGP 800VO

  • Product code: TGP 800VO
  • Manufacturer: Henkel
  • Package size:
  • Shelf Life: 6 months
Request Quote Request Sample

BERGQUIST GAP PAD TGP 800VO (Highly Conformable, Thermally Conductive Material for Filling Air Gaps) is a cost-effective, thermally conductive interface material. The material is a filled, thermally conductive polymer supplied on a rubber-coated fiberglass carrier allowing for easy material handling. The conformable nature of BERGQUIST® GAP PAD® TGP 800VO allows the pad to fill in air gaps between PC boards and heat sinks or a metal chassis.

FEATURES:

  • Thermal conductivity: 0.8 W/m-K
  • Enhanced puncture, shear and tear resistance
  • Conformable gap filling material
  • Electrically isolating

APPLICATIONS:

  • Telecommunications
  • Computers and peripherals
  • Power conversion
  • Between heat-generating semiconductors and a heat sink
  • Areas where heat needs to be transferred to a frame, chassis, or other type of heat spreader
  • Between heat-generating magnetic components and a heat sink

 

Color Gold/Pink Gold/Pink Visual
Reinforcement Carrier Fiberglass Fiberglass —
Thickness (in.) / (mm) 0.020 to 0.250 0.508 to 6.350 ASTM D374
Inherent Surface Tack (1-sided) 1 1 —
Density, Bulk, Rubber (g/cc) 1.6 1.6 ASTM D792
Heat Capacity ( J/g-K) 1.0 1.0 ASTM E1269
Hardness, Bulk Rubber (Shore 00) 40 40 ASTM D2240
Young’s Modulus (psi) / (kPa) 100 689 ASTM D575
Continuous Use Temp. (°F) / (°C) -76 to 392 -60 to 200 —
Dielectric Breakdown Voltage (VAC) > 6,000 > 6,000 ASTM D149
Dielectric Constant (1,000 Hz) 5.5 5.5 ASTM D150
Volume Resistivity (Ω-m) 1011 1011 ASTM D257
Flame Rating V-O V-O UL 94
Thermal Conductivity (W/m-K) 0.8 0.8 ASTM D5470

 

TDS:Download

Get MSDS

    Leave your information via Form, our Technical Support Team will contact you shortly!

    Outstanding Feature Product Group