BERGQUIST GAP PAD TGP 800VO (Highly Conformable, Thermally Conductive Material for Filling Air Gaps) is a cost-effective, thermally conductive interface material. The material is a filled, thermally conductive polymer supplied on a rubber-coated fiberglass carrier allowing for easy material handling. The conformable nature of BERGQUIST® GAP PAD® TGP 800VO allows the pad to fill in air gaps between PC boards and heat sinks or a metal chassis.
FEATURES:
- Thermal conductivity: 0.8 W/m-K
- Enhanced puncture, shear and tear resistance
- Conformable gap filling material
- Electrically isolating
APPLICATIONS:
- Telecommunications
- Computers and peripherals
- Power conversion
- Between heat-generating semiconductors and a heat sink
- Areas where heat needs to be transferred to a frame, chassis, or other type of heat spreader
- Between heat-generating magnetic components and a heat sink
| Color | Gold/Pink | Gold/Pink | Visual |
| Reinforcement Carrier | Fiberglass | Fiberglass | — |
| Thickness (in.) / (mm) | 0.020 to 0.250 | 0.508 to 6.350 | ASTM D374 |
| Inherent Surface Tack (1-sided) | 1 | 1 | — |
| Density, Bulk, Rubber (g/cc) | 1.6 | 1.6 | ASTM D792 |
| Heat Capacity ( J/g-K) | 1.0 | 1.0 | ASTM E1269 |
| Hardness, Bulk Rubber (Shore 00) | 40 | 40 | ASTM D2240 |
| Young’s Modulus (psi) / (kPa) | 100 | 689 | ASTM D575 |
| Continuous Use Temp. (°F) / (°C) | -76 to 392 | -60 to 200 | — |
| Dielectric Breakdown Voltage (VAC) | > 6,000 | > 6,000 | ASTM D149 |
| Dielectric Constant (1,000 Hz) | 5.5 | 5.5 | ASTM D150 |
| Volume Resistivity (Ω-m) | 1011 | 1011 | ASTM D257 |
| Flame Rating | V-O | V-O | UL 94 |
| Thermal Conductivity (W/m-K) | 0.8 | 0.8 | ASTM D5470 |