BERGQUIST® GAP PAD® TGP 1350

BERGQUIST® GAP PAD® TGP 1350 is a highly compliant GAP PAD® material that is ideal for fragile component leads. The material includes a PEN film, which
facilitates rework and improves puncture resistance and handling characteristics. The tacky side of BERGQUIST® GAP PAD® TGP 1350 maintains a conformable, yet elastic nature that provides excellent interfacing and wet-out characteristics, even to surfaces with high roughness or uneven topography. BERGQUIST® GAP
PAD® TGP 1350 has inherent tack on one side of the material, eliminating the need for thermally impeding adhesive layers. It is highly recommended that the PEN film be left intact. However, film removal will not have a significant impact on thermal performance.

FEATURES:

Thermal conductivity: 1.3 W/m-K (bulk rubber)
PEN film reinforcement allows easy rework and provides puncture and tear resistance
Highly conformable/low hardness
Low strain on fragile components

APPLICATIONS:

Lighting and LED applications
When low strain is required for fragile component leads
Computers and peripherals
Telecommunications
Between any heat-generating semiconductor and a heat sink

PROPERTY	IMPERIAL VALUE	METRIC VALUE	TEST METHOD
Color	Light Pink	Light Pink	Visual
Reinforcement Carrier	PEN film	PEN film	—
Thickness (in.) / (mm)	0.020 to 0.125	0.508 to 3.175	ASTM D374
Inherent Surface Tack (1-sided)	1	1	—
Density, Bulk, Rubber (g/cc)	1.8	1.8	ASTM D792
Heat Capacity ( J/g-K)	1.0	1.0	ASTM E1269
Hardness, Bulk Rubber (Shore 00)	30	30	ASTM D2240
Young’s Modulus (psi) / (kPa)	16	110	ASTM D575
Continuous Use Temp. (°F) / (°C)	-76 to 302	-60 to 200	—
Dielectric Breakdown Voltage (VAC)	> 6,000	> 6,000	ASTM D149
Dielectric Constant (1,000 Hz)	5.0	5.0	ASTM D150
Volume Resistivity (Ω-m)	10^9	10^9	ASTM D257
Flame Rating	V-O	V-O	UL 94
Thermal Conductivity (W/m-K)	1.0	1.0	ASTM D5470

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