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BERGQUIST® GAP PAD® TGP 1000VOUS Prostech Vietnam

BERGQUIST® GAP PAD® TGP 1000VOUS

  • Product code: TGP 1000VOUS
  • Manufacturer: Henkel
  • Package size:
  • Shelf Life: 6 months

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Ultra-Conformable, Thermally Conductive Material for Filling Air Gaps

BERGQUIST GAP PAD TGP 1000VOUS is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature
of the material also gives excellent low stress vibration dampening and shock absorbing characteristics. BERGQUIST GAP PAD TGP 1000VOUS is an
electrically isolating material, which allows its use in applications requiring isolation between heat sinks and high voltage, bare-leaded devices.

FEATURES:

  • Thermal conductivity: 1.0 W/m-K
  • Highly conformable, low hardness
  • “Gel-like” modulus
  • Decreased strain
  • Puncture-, shear- and tear-resistant
  • Electrically isolating

APPLICATIONS:

  • Telecommunications
  • Computers and peripherals
  • Power conversion
  • Between heat-generating semiconductors or magnetic components and a heat sink
  • Areas where heat needs to be transferred to a frame, chassis, or other type of heat spreader

 

 

PROPERTY    IMPERIAL VALUE METRIC VALUE TEST METHOD
Color Mauve/Pink Mauve/Pink Visual
Reinforcement Carrier Fiberglass Fiberglass —
Thickness (in.) / (mm) 0.020 to 0.250  0.508 to 6.350  ASTM D374
Inherent Surface Tack (1-sided) 1 1 —
Density, Bulk, Rubber (g/cc) 1.6 1.6 ASTM D792
Heat Capacity ( J/g-K) 1.0 1.0 ASTM E1269
Hardness, Bulk Rubber (Shore 00) 5 5 ASTM D2240
Young’s Modulus (psi) / (kPa) 8   55 ASTM D575
Continuous Use Temp. (°F) / (°C) 76 to 392  -60 to 200 —
Dielectric Breakdown Voltage (VAC) 6,000 6,000 ASTM D149
Dielectric Constant (1,000 Hz) 5.5 5.5 ASTM D150
Volume Resistivity (Ω-m) 10^11 10^11 ASTM D257
Flame Rating V-O V-O UL 94
Thermal Conductivity (W/m-K) 1.0 1.0 ASTM D5470

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