BERGQUIST GAP FILLER TGF 2000

A thermally conductive, liquid gap filler material.

FEATURES AND BENEFITS

● Thermal Conductivity: 2.0 W/m-K
● Ultra-conforming, designed for fragile and low-stress applications
● Ambient and accelerated cure schedules
● 100% solids – no cure by-products
● Excellent low and high temperature mechanical and chemical stability

BERGQUIST GAP FILLER TGF 2000 is a high performance, thermally conductive, liquid gap filling material supplied as a two-component, room or elevated temperature curing system. The material provides a balance of cured material properties and good compression set (memory). The result is a soft, thermally conductive, form-in-place elastomer ideal for coupling “hot” electronic components mounted on PC boards with an adjacent metal case or heat sink. Before cure, BERGQUIST GAP FILLER TGF 2000 flows under pressure like a grease. After cure, it does not pump from the interface as a result of thermal cycling and is dry to the touch.