Product Description
Bectron® SG 75V1-75 / SG 79V1-75
Bectron® SG 75V1-75 when mixed with Bectron® SG 79V1-75 will cure at room temperature to form a trans- parent gel in about 15 minutes. Elasticity and dielectric properties of the final gel re- main largely stable in a wide range of temperatures, between -40°C and +180°C. A 1:1 mixing ratio allows easy and safe processing of the system.
Features of Bectron® SG 75V1-75 / SG 79V1-75
- Addition cure system
- Fast curing at room temperature
- Long term thermal resistance
- Transparency and Elasticity
- Soft and elastic self repearing gel
Application of Bectron® SG 75V1-75 / SG 79V1-75
- Bectron® SG 75V1-75 cross-linked with Bectron® SG 79V1-75 is specifically designed for protection of elec- tronic components against mechanical stress and vi- bration.
- Thanks to its high thermal resistance and a low ions content Bectron® SG 75V1-75 system is particularly suited for potting semiconductors in power modules.
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SYSTEM SPECIFICATIONS
Property | Conditions | Method | Bectron® SG 75V1-75 | Bectron® SG 79V1-75 | Units |
Viscosity | 25°C | V 18 | 900 ÷ 1100 | 700 ÷ 1000 | mPas |
Gel time | 120°C | H 18 | 2 ÷ 5 | min | |
Penetration | Cured 1h at 120°C | M 77 | 60 ÷ 90 | mm/10 | |
TYPICAL PRODUCTS CHARACTERISTICS
Property | Bectron® SG 75V1-75 | Bectron® SG 79V1-75 |
Colour | Transparent | Transparent |
Spec. gravity 20°C [g/cm3] | 0.97 | 0.97 |
Shelf Life | 12 months | 12 months |
TYPICAL MIXTURE CHARACTERISTICS
Mixing Ratio (parts by weight) | 1:1 |
Viscosity of mixture @ 25°C [mPas] | 925 |
Working Time at Room Temperature [min] | 45 |
