Product Description
Bectron® SG 75V1-75 / SG 79V1-75
Bectron® SG 75V1-75 when mixed with Bectron® SG 79V1-75 will cure at room temperature to form a trans- parent gel in about 15 minutes. Elasticity and dielectric properties of the final gel re- main largely stable in a wide range of temperatures, between -40°C and +180°C. A 1:1 mixing ratio allows easy and safe processing of the system.
Features of Bectron® SG 75V1-75 / SG 79V1-75
- Addition cure system
- Fast curing at room temperature
- Long term thermal resistance
- Transparency and Elasticity
- Soft and elastic self repearing gel
Application of Bectron® SG 75V1-75 / SG 79V1-75
- Bectron® SG 75V1-75 cross-linked with Bectron® SG 79V1-75 is specifically designed for protection of elec- tronic components against mechanical stress and vi- bration.
- Thanks to its high thermal resistance and a low ions content Bectron® SG 75V1-75 system is particularly suited for potting semiconductors in power modules.
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SYSTEM SPECIFICATIONS
|
Property |
Conditions |
Method |
Bectron® SG 75V1-75 |
Bectron® SG 79V1-75 |
Units |
|
Viscosity |
25°C |
V 18 |
900 ÷ 1100 |
700 ÷ 1000 |
mPas |
|
Gel time |
120°C |
H 18 |
2 ÷ 5 |
min |
|
|
Penetration |
Cured 1h at 120°C |
M 77 |
60 ÷ 90 |
mm/10 |
|
TYPICAL PRODUCTS CHARACTERISTICS
|
Property |
Bectron® SG 75V1-75 |
Bectron® SG 79V1-75 |
|
Colour |
Transparent |
Transparent |
|
Spec. gravity 20°C [g/cm3] |
0.97 |
0.97 |
|
Shelf Life |
12 months |
12 months |
TYPICAL MIXTURE CHARACTERISTICS
|
Mixing Ratio (parts by weight) |
1:1 |
|
Viscosity of mixture @ 25°C [mPas] |
925 |
|
Working Time at Room Temperature [min] |
45 |
