• Products
    • By Application
      • Specialty Materials
      • Hidden
      • Hidden
      • Hidden
      • Adhesives
      • Tapes
      • Curing System
      • Converting Services
      • Abrasives
      • Conformal Coatings
      • Dispensing System
      • Material Formulation Customization
      • Elastomeric Materials
      • Electronics Auxiliary Chemicals
      • Low Pressure Molding Machine
      • Low Pressurea Molding Services
      • Electronic Staking/Fixing
      • Electronic Underfill
      • Metrology Equipment
      • Robotic & Automation
      • EMI Shielding
      • Impregnating resin
      • Tape Converter Machine
      • Package Customization
      • Immersion Cooling Fluids
      • Industrial Coating
      • Hidden
      • Labelling Printing
      • Low Pressure Molding
      • Hidden
      • Hidden
      • Lubricant
      • Insulation
      • Hidden
      • Hidden
      • Activator, Initiator & Accelerator
      • Cleaner Degreaser
      • Hidden
      • Hidden
      • Maintain and Repair
      • Temporary Masking
      • Hidden
      • Hidden
      • Thermal Management
      • Thinner Liquid
      • Hidden
      • Hidden
      • Potting – Encapsulant
      • Primer and Adhesion Promoter
      • Sealant & Gasketing Liquids
      • Soldering Materials
      • Hidden
      • Other Industrial Materials
    • By Market
      • Electronics
      • Transportation
      • Medical
      • Battery
      • Electrical
      • General Industrial
      • Handphone
      • Lighting
      • Packaging
      • Power
      • Semiconductor
      • Textile & Garment
      • Consumer Products
    • By Manufacturer
      • 3M
      • AB Chimie
      • Actnano
      • AETP
      • Almit
      • Aventek
      • Balver Zinn
      • Banseok
      • Bostik
      • Cartell
      • Chemtronics
      • Daheng
      • Denka
      • Dymax
      • Elantas
      • Everwide
      • EPO-TEK
      • Gluditec
      • H. B. Fuller
      • Henkel
      • Heraeus
      • Hexagon
      • Hikrobot
      • Humiseal
      • Huntsman
      • ITW Performance Polymers
      • Jones Tech
      • Jowat
      • Kester
      • Kuka
      • Kunshan Hexin
      • Lamieux
      • Markem imaje
      • Medmix
      • Metrology
      • MG Chemicals
      • Momentive
      • Nordson
      • Permabond
      • Peters
      • Prostech
      • Recochem
      • RedRing Solder
      • Rogers
      • Rozitek
      • Saint Gobain
      • Seayu
      • Shenmao
      • Shenzhen HFC
      • Shiu Li Lipoly
      • Somar Corp.
      • Stockmeier
      • Sulzer
      • t-Global
      • Techspray
      • Threebond
      • Toyobo
      • Vietape
      • Weldtone
      • Xetar
      • YINCAE
  • Solutions
    • Industrial Adhesive
    • Industrial Tape
    • Low Pressure Molding Solutions
    • Thermal Interface Materials Solutions
    • Conformal Coating Solution
    • Potting – Encapsulation Solutions
    • 3M Novec Alternatives
    • Automated Guided Vehicles (AGVs) solution
    • Automation System
    • Cleaning and Degreasing
    • Elastometric Solution
    • EMI Shielding Solutions
    • Impregnating
    • Liquid Media Curing
    • Printed Circuit Board Solutions
    • Single Component Dispensing System
    • Surface Treatment
    • Temporary Masking
  • Industries
    • Automotive Industry
    • Motor Industry
    • Battery Energy Storage System (BESS)
    • Furniture & Building Construction
    • Speaker
    • Image Sensor & Camera Module
    • Transformer
    • Medical
    • Construction
    • Electronics Industry
    • Sports and Fashion
  • Resource
    • Glossary
    • Video
    • Library
    • Blog
  • Contact
  • FAQ
Skip to content
site-logo

Search Result

  • Products
    • By Application
      • Specialty Materials
      • Hidden
      • Hidden
      • Hidden
      • Adhesives
      • Tapes
      • Curing System
      • Converting Services
      • Abrasives
      • Conformal Coatings
      • Dispensing System
      • Material Formulation Customization
      • Elastomeric Materials
      • Electronics Auxiliary Chemicals
      • Low Pressure Molding Machine
      • Low Pressurea Molding Services
      • Electronic Staking/Fixing
      • Electronic Underfill
      • Metrology Equipment
      • Robotic & Automation
      • EMI Shielding
      • Impregnating resin
      • Tape Converter Machine
      • Package Customization
      • Immersion Cooling Fluids
      • Industrial Coating
      • Hidden
      • Labelling Printing
      • Low Pressure Molding
      • Hidden
      • Hidden
      • Lubricant
      • Insulation
      • Hidden
      • Hidden
      • Activator, Initiator & Accelerator
      • Cleaner Degreaser
      • Hidden
      • Hidden
      • Maintain and Repair
      • Temporary Masking
      • Hidden
      • Hidden
      • Thermal Management
      • Thinner Liquid
      • Hidden
      • Hidden
      • Potting – Encapsulant
      • Primer and Adhesion Promoter
      • Sealant & Gasketing Liquids
      • Soldering Materials
      • Hidden
      • Other Industrial Materials
    • By Market
      • Electronics
      • Transportation
      • Medical
      • Battery
      • Electrical
      • General Industrial
      • Handphone
      • Lighting
      • Packaging
      • Power
      • Semiconductor
      • Textile & Garment
      • Consumer Products
    • By Manufacturer
      • 3M
      • AB Chimie
      • Actnano
      • AETP
      • Almit
      • Aventek
      • Balver Zinn
      • Banseok
      • Bostik
      • Cartell
      • Chemtronics
      • Daheng
      • Denka
      • Dymax
      • Elantas
      • Everwide
      • EPO-TEK
      • Gluditec
      • H. B. Fuller
      • Henkel
      • Heraeus
      • Hexagon
      • Hikrobot
      • Humiseal
      • Huntsman
      • ITW Performance Polymers
      • Jones Tech
      • Jowat
      • Kester
      • Kuka
      • Kunshan Hexin
      • Lamieux
      • Markem imaje
      • Medmix
      • Metrology
      • MG Chemicals
      • Momentive
      • Nordson
      • Permabond
      • Peters
      • Prostech
      • Recochem
      • RedRing Solder
      • Rogers
      • Rozitek
      • Saint Gobain
      • Seayu
      • Shenmao
      • Shenzhen HFC
      • Shiu Li Lipoly
      • Somar Corp.
      • Stockmeier
      • Sulzer
      • t-Global
      • Techspray
      • Threebond
      • Toyobo
      • Vietape
      • Weldtone
      • Xetar
      • YINCAE
  • Solutions
    • Industrial Adhesive
    • Industrial Tape
    • Low Pressure Molding Solutions
    • Thermal Interface Materials Solutions
    • Conformal Coating Solution
    • Potting – Encapsulation Solutions
    • 3M Novec Alternatives
    • Automated Guided Vehicles (AGVs) solution
    • Automation System
    • Cleaning and Degreasing
    • Elastometric Solution
    • EMI Shielding Solutions
    • Impregnating
    • Liquid Media Curing
    • Printed Circuit Board Solutions
    • Single Component Dispensing System
    • Surface Treatment
    • Temporary Masking
  • Industries
    • Automotive Industry
    • Motor Industry
    • Battery Energy Storage System (BESS)
    • Furniture & Building Construction
    • Speaker
    • Image Sensor & Camera Module
    • Transformer
    • Medical
    • Construction
    • Electronics Industry
    • Sports and Fashion
  • Resource
    • Glossary
    • Video
    • Library
    • Blog
  • Contact
  • FAQ
  • en
  • vi
  • cn
Home > Products > By Manufacturer > Elantas > Bectron® PT 4601
Bectron® PT 4601

Bectron® PT 4601

  • Product code: Bectron® PT 4601
  • Manufacturer: Elantas
  • Package size:
  • Shelf Life:
Request Quote Request Sample
  • Description
  • Specification
  • TDS/MSDS
  • Related Article
  • Product Description
  • Key Features

Product Description

  • This advanced Bectron® PT 4601 is a specialized solvent-free, one-component polyurethane-based transparent thick film coating.
  • It uniquely cures through both UV irradiation for rapid processing and by moisture in shadow areas, ensuring complete polymerization.
  • Designed with thixotropic properties, it enables precise application to specific areas on PCBs, minimizing unwanted flow.
  • This coating from ELANTAS Europe GmbH forms an elastic, flexible layer that maintains integrity down to -40°C, offering excellent adhesion and insulation, even after wet storage.
  • Ideal for sophisticated electronics like surface mount devices and hybrids, it provides outstanding protection against moisture, corrosion, migration, and vibration, fully complying with RoHS requirements.

Key Features

  • Rapid UV curing capability
  • Effective moisture shadow-cure mechanism
  • Exceptional thermal cycling performance from -40°C to +120°C
  • Maintains flexibility at temperatures as low as -40°C
  • Exhibits strong adhesion to diverse substrates
  • Provides excellent dielectric properties
  • Formulated as a solvent-free material
  • Features thixotropic rheology for controlled application
  • Complies with RoHS directives
  • Offers robust protection against moisture, corrosion, migration, and vibration

Get MSDS

    Leave your information via Form, our Technical Support Team will contact you shortly!

    YINCAE Solder Joint Encapsulants SMT 266
    YINCAE Solder Joint Encapsulants SMT 266
    https://prostech.vn/yincae-solder-joint-encapsulants-smt-266/

    Key Features of YINCAE Solder Joint Encapsulants SMT 266Applications for YINCAE Solder Joint Encapsulants SMT 266 Introducing YINCAE Solder Joint

    YINCAE Solder Joint Encapsulants SMT 256
    YINCAE Solder Joint Encapsulants SMT 256
    https://prostech.vn/yincae-solder-joint-encapsulants-smt-256/

    Elevate Reliability with YINCAE Solder Joint Encapsulants SMT 256Key Features & BenefitsApplications of YINCAE Solder Joint Encapsulants SMT 256 YINCAE

    YINCAE Solder Joint Encapsulants SMT 256 BC
    YINCAE Solder Joint Encapsulants SMT 256 BC
    https://prostech.vn/yincae-solder-joint-encapsulants-smt-256-bc/

    Why Choose YINCAE Solder Joint Encapsulants SMT 256 BC?Key Applications YINCAE Solder Joint Encapsulants SMT 256 BC is a cutting-edge

    YINCAE Solder Joint Encapsulants SMT 138
    YINCAE Solder Joint Encapsulants SMT 138
    https://prostech.vn/yincae-solder-joint-encapsulants-smt-138/

    Key Features of YINCAE Solder Joint Encapsulants SMT 138Versatile Applications YINCAE Solder Joint Encapsulants SMT 138 is a cutting-edge, low-temperature

    Similar Products

    • ELANTAS MC 62 V RESIN W 363 V HARDENER

      ELANTAS MC 62 V RESIN W 363 V HARDENER

      See details
    • ELANTAS MC 62 V RESIN W 363 V HARDENER

      ELANTAS MC 62 V RESIN W 363 V HARDENER

      See details
    • ELANTAS ELAN-Bond HP-TC Thermally Conductive Encapsulant

      ELANTAS ELAN-Bond HP-TC Thermally Conductive Encapsulant

      See details
    • Bectron PT 4700 N

      Bectron PT 4700 N

      See details
    Bectron® PT 4601

      Leave your information via Form, our Technical Support Team will contact you shortly!

      Bectron® PT 4601

        Leave your information via Form, our Technical Support Team will contact you shortly!

        Bectron® PT 4601

          Leave your information via Form, our Technical Support Team will contact you shortly!

          Bectron® PT 4601

            Leave your information via Form, our Technical Support Team will contact you shortly!

            Specialty Materials & Manufacturing Solutions

            • Home
            • Products
            • Solutions
            • Industries
            • Resource
            • Contact

            Follow Us

            © 2021 Prostech. All rights reserved.

            Asking for Product Information and Technical Consultant

              Leave your information via Form, our Technical Support Team will contact you shortly!