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Home > Products > By Manufacturer > Elantas > Bectron® > BECTRON® PK 5553 (1 Component, heat-curing)
BECTRON® SA 70P9-60 Silicone Adhesives Prostech Vietnam

BECTRON® PK 5553 (1 Component, heat-curing)

  • Product code: BECTRON® PK 5553
  • Manufacturer: Bectron®
  • Package size:
  • Shelf Life: 6 months (23 °C)
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  • Description
  • Specification
  • TDS/MSDS
  • Related Article
  • Product Introduction
  • BECTRON® PK 5553 Features
  • BECTRON® PK 5553 Applications
  • About Prostech

Product Introduction

BECTRON® PK 5553 is a high-performance, one-component polyurethane encapsulant designed to protect electronic assemblies from thermal, mechanical, and environmental stress. This black resin features a balanced viscosity of 3500 mPas, offering smooth application and reliable coverage, even on complex PCB surfaces. It cures efficiently at +90 °C within 30 minutes, forming a durable thermoset structure with a Shore D hardness of 30. BECTRON® PK 5553 is capable of maintaining stable performance under prolonged exposure to temperatures up to +130 °C for 20,000 hours. With its 0.3 W/mK thermal conductivity and environmentally friendly, VOC-free formulation, it delivers dependable protection for sensitive components in industrial, automotive, and consumer electronics applications.

BECTRON® PK 5553 Features

  • Single-component, ready-to-use formulation – no mixing or pot life concerns
  • Fast curing in 30 minutes at +90 °C – efficient thermal processing
  • Forms a robust thermoset polymer with Shore hardness of 30 D
  • Stable in harsh temperature cycling conditions from -50 °C to +130 °C
  • Thermal conductivity of 0.3 W/mK – enables moderate heat dissipation
  • Low exotherm and minimal shrinkage – safe for delicate or heat-sensitive components
  • Glass transition temperature below -60 °C – suitable for extreme cold environments
  • Good adhesion on standard materials used in electronics
  • Environmentally friendly – zero VOCs and 100% solids content

BECTRON® PK 5553 Applications

  • Encapsulation of electronic components requiring mechanical strength and thermal durability
  • Thick film protective coatings on PCBs and hybrid modules
  • Dam & Fill processes for controlled encapsulation using wet-on-wet methods
  • Protection for automotive control units and under-hood electronics
  • Industrial and consumer electronics exposed to temperature extremes or vibration
  • Infrared or thermal oven curing applications requiring consistent performance
  • Scenarios demanding long-term heat and chemical resistance in confined spaces

About Prostech

Prostech offers specialty materials (adhesives, tapes, thermal interface materials, insulating materials, sealants, PCB protection materials, …) along with manufacturing solutions. We proudly serve a wide range of industries and are an authorized distributor for leading global manufacturers of industrial materials and equipment. Our product range is designed to deliver customized solutions that address each customer’s unique needs.

With years of experience and a successful project history, we are confident in our ability to provide comprehensive material solutions. These solutions effectively tackle the challenges manufacturers face. To explore our full product catalog, simply click here. Our dedicated team is ready to assist with:

  • Provide quotation, sample, TDS/MSDS, and technical consultation
  • Testing sample quality and verifying product compatibility in our laboratory
  • Customizing material formulas for special applications
  • Adapting product sizes, quantities, and packaging to meet specific needs
  • Offering expert advice on suitable equipment and automation processes
  • Delivering technical training and on-site support for optimal product use

Moreover, Prostech ensures the safe and accurate global delivery of all materials, including “dangerous goods”, in compliance with legal regulations. For personalized technical support or to receive a quotation, please contact us today.

PropertyValue
ColourBlack
Viscosity [mPas]3500
Max Temp. [°C/20.000 h]+130 °C
Hardness [Shore]30 D
Cure Speed [min @ +90 °C]30
Thermal Conductivity [W/mK]0.3

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    BECTRON® PK 5553 (1 Component, heat-curing)

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      BECTRON® PK 5553 (1 Component, heat-curing)

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        BECTRON® PK 5553 (1 Component, heat-curing)

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          BECTRON® PK 5553 (1 Component, heat-curing)

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