• Products
    • By Application
      • Specialty Materials
      • Hidden
      • Hidden
      • Hidden
      • Adhesives
      • Tapes
      • Curing System
      • Converting Services
      • Abrasives
      • Conformal Coatings
      • Dispensing System
      • Material Formulation Customization
      • Elastomeric Materials
      • Electronics Auxiliary Chemicals
      • Low Pressure Molding Machine
      • Low Pressurea Molding Services
      • Electronic Staking/Fixing
      • Electronic Underfill
      • Metrology Equipment
      • Robotic & Automation
      • EMI Shielding
      • Impregnating resin
      • Tape Converter Machine
      • Package Customization
      • Immersion Cooling Fluids
      • Industrial Coating
      • Hidden
      • Labelling Printing
      • Low Pressure Molding
      • Hidden
      • Hidden
      • Lubricant
      • Insulation
      • Hidden
      • Hidden
      • Activator, Initiator & Accelerator
      • Cleaner Degreaser
      • Hidden
      • Hidden
      • Maintain and Repair
      • Temporary Masking
      • Hidden
      • Hidden
      • Thermal Management
      • Thinner Liquid
      • Hidden
      • Hidden
      • Potting – Encapsulant
      • Primer and Adhesion Promoter
      • Sealant & Gasketing Liquids
      • Soldering Materials
      • Hidden
      • Other Industrial Materials
    • By Market
      • Electronics
      • Transportation
      • Medical
      • Battery
      • Electrical
      • General Industrial
      • Handphone
      • Lighting
      • Packaging
      • Power
      • Semiconductor
      • Textile & Garment
      • Consumer Products
    • By Manufacturer
      • 3M
      • AB Chimie
      • Actnano
      • AETP
      • Almit
      • Aventek
      • Balver Zinn
      • Banseok
      • Bostik
      • Cartell
      • Chemtronics
      • Daheng
      • Denka
      • Dymax
      • Elantas
      • Everwide
      • EPO-TEK
      • Gluditec
      • H. B. Fuller
      • Henkel
      • Heraeus
      • Hexagon
      • Hikrobot
      • Humiseal
      • Huntsman
      • ITW Performance Polymers
      • Jones Tech
      • Jowat
      • Kester
      • Kuka
      • Kunshan Hexin
      • Lamieux
      • Markem imaje
      • Medmix
      • Metrology
      • MG Chemicals
      • Momentive
      • Nordson
      • Permabond
      • Peters
      • Prostech
      • Recochem
      • RedRing Solder
      • Rogers
      • Rozitek
      • Saint Gobain
      • Seayu
      • Shenmao
      • Shenzhen HFC
      • Shiu Li Lipoly
      • Somar Corp.
      • Stockmeier
      • Sulzer
      • t-Global
      • Techspray
      • Threebond
      • Toyobo
      • Vietape
      • Weldtone
      • Xetar
      • YINCAE
  • Solutions
    • Industrial Adhesive
    • Industrial Tape
    • Low Pressure Molding Solutions
    • Thermal Interface Materials Solutions
    • Conformal Coating Solution
    • Potting – Encapsulation Solutions
    • 3M Novec Alternatives
    • Automated Guided Vehicles (AGVs) solution
    • Automation System
    • Cleaning and Degreasing
    • Elastometric Solution
    • EMI Shielding Solutions
    • Impregnating
    • Liquid Media Curing
    • Printed Circuit Board Solutions
    • Single Component Dispensing System
    • Surface Treatment
    • Temporary Masking
  • Industries
    • Automotive Industry
    • Motor Industry
    • Battery Energy Storage System (BESS)
    • Furniture & Building Construction
    • Speaker
    • Image Sensor & Camera Module
    • Transformer
    • Medical
    • Construction
    • Electronics Industry
    • Sports and Fashion
  • Resource
    • Glossary
    • Video
    • Library
    • Blog
  • Contact
Skip to content
site-logo

Search Result

  • Products
    • By Application
      • Specialty Materials
      • Hidden
      • Hidden
      • Hidden
      • Adhesives
      • Tapes
      • Curing System
      • Converting Services
      • Abrasives
      • Conformal Coatings
      • Dispensing System
      • Material Formulation Customization
      • Elastomeric Materials
      • Electronics Auxiliary Chemicals
      • Low Pressure Molding Machine
      • Low Pressurea Molding Services
      • Electronic Staking/Fixing
      • Electronic Underfill
      • Metrology Equipment
      • Robotic & Automation
      • EMI Shielding
      • Impregnating resin
      • Tape Converter Machine
      • Package Customization
      • Immersion Cooling Fluids
      • Industrial Coating
      • Hidden
      • Labelling Printing
      • Low Pressure Molding
      • Hidden
      • Hidden
      • Lubricant
      • Insulation
      • Hidden
      • Hidden
      • Activator, Initiator & Accelerator
      • Cleaner Degreaser
      • Hidden
      • Hidden
      • Maintain and Repair
      • Temporary Masking
      • Hidden
      • Hidden
      • Thermal Management
      • Thinner Liquid
      • Hidden
      • Hidden
      • Potting – Encapsulant
      • Primer and Adhesion Promoter
      • Sealant & Gasketing Liquids
      • Soldering Materials
      • Hidden
      • Other Industrial Materials
    • By Market
      • Electronics
      • Transportation
      • Medical
      • Battery
      • Electrical
      • General Industrial
      • Handphone
      • Lighting
      • Packaging
      • Power
      • Semiconductor
      • Textile & Garment
      • Consumer Products
    • By Manufacturer
      • 3M
      • AB Chimie
      • Actnano
      • AETP
      • Almit
      • Aventek
      • Balver Zinn
      • Banseok
      • Bostik
      • Cartell
      • Chemtronics
      • Daheng
      • Denka
      • Dymax
      • Elantas
      • Everwide
      • EPO-TEK
      • Gluditec
      • H. B. Fuller
      • Henkel
      • Heraeus
      • Hexagon
      • Hikrobot
      • Humiseal
      • Huntsman
      • ITW Performance Polymers
      • Jones Tech
      • Jowat
      • Kester
      • Kuka
      • Kunshan Hexin
      • Lamieux
      • Markem imaje
      • Medmix
      • Metrology
      • MG Chemicals
      • Momentive
      • Nordson
      • Permabond
      • Peters
      • Prostech
      • Recochem
      • RedRing Solder
      • Rogers
      • Rozitek
      • Saint Gobain
      • Seayu
      • Shenmao
      • Shenzhen HFC
      • Shiu Li Lipoly
      • Somar Corp.
      • Stockmeier
      • Sulzer
      • t-Global
      • Techspray
      • Threebond
      • Toyobo
      • Vietape
      • Weldtone
      • Xetar
      • YINCAE
  • Solutions
    • Industrial Adhesive
    • Industrial Tape
    • Low Pressure Molding Solutions
    • Thermal Interface Materials Solutions
    • Conformal Coating Solution
    • Potting – Encapsulation Solutions
    • 3M Novec Alternatives
    • Automated Guided Vehicles (AGVs) solution
    • Automation System
    • Cleaning and Degreasing
    • Elastometric Solution
    • EMI Shielding Solutions
    • Impregnating
    • Liquid Media Curing
    • Printed Circuit Board Solutions
    • Single Component Dispensing System
    • Surface Treatment
    • Temporary Masking
  • Industries
    • Automotive Industry
    • Motor Industry
    • Battery Energy Storage System (BESS)
    • Furniture & Building Construction
    • Speaker
    • Image Sensor & Camera Module
    • Transformer
    • Medical
    • Construction
    • Electronics Industry
    • Sports and Fashion
  • Resource
    • Glossary
    • Video
    • Library
    • Blog
  • Contact
  • en
  • vi
  • cn
Home > Products > By Market > General Industrial > Araldite 2014-1 Two component epoxy paste adhesive
Araldite 2014-1 Two component epoxy paste adhesive Prostech Vietnam

Araldite 2014-1 Two component epoxy paste adhesive

  • Product code: 2014-1
  • Manufacturer: Huntsman
  • Package size: 200 ml/ 2.5kg/ 25kg
  • Shelf Life:

Request Quote Request Sample
  • Description
  • Specification
  • TDS/MSDS
  • Related Article

Araldite 2014-1 is a two component, room temperature curing, thixotropic paste adhesive of high strength with good environmental and excellent chemical resistance. Used for bonding of metals, electronic components, GRP structures and many other items where a higher than normal temperature or more aggressive environment is to be encountered in service. The low out gassing makes this product suitable for specialist electronic telecommunication and aerospace applications.

FEATURES:

  • Grey paste
  • High temperature and chemical resistance
  • Low shrinkage
  • Very resistant to water and a variety of chemicals
  • Gap filling, non sagging up to 5mm thickness

APPLICATIONS:

  • This multi-purpose paste has the capabilities to bond a wide range of materials including Metal, Ceramic, Glass, Rubber and Wood.
  • Ideal for the craftsman, as well as most industrial applications.
Property2014-1 / A2014-1 / B2014-1 (Mixed)
Colour (visual) (A112)*beige pastegrey pastegrey paste
Specific gravityca. 1.6ca. 1.6ca. 1.6
Viscosity at 25°C (Pas)ca. 100thixotropicthixotropic
Pot Life (100 gm at 25°C)––60 minutes
Lap shear strength at 25°C (A501)*––> 14 MPa
Mixing Rate by weight1001001:1

TDS:Download

Get MSDS

    Leave your information via Form, our Technical Support Team will contact you shortly!

    YINCAE Solder Joint Encapsulants SMT 266
    YINCAE Solder Joint Encapsulants SMT 266
    https://prostech.vn/yincae-solder-joint-encapsulants-smt-266/

    Key Features of YINCAE Solder Joint Encapsulants SMT 266Applications for YINCAE Solder Joint Encapsulants SMT 266 Introducing YINCAE Solder Joint

    YINCAE Solder Joint Encapsulants SMT 256
    YINCAE Solder Joint Encapsulants SMT 256
    https://prostech.vn/yincae-solder-joint-encapsulants-smt-256/

    Elevate Reliability with YINCAE Solder Joint Encapsulants SMT 256Key Features & BenefitsApplications of YINCAE Solder Joint Encapsulants SMT 256 YINCAE

    YINCAE Solder Joint Encapsulants SMT 256 BC
    YINCAE Solder Joint Encapsulants SMT 256 BC
    https://prostech.vn/yincae-solder-joint-encapsulants-smt-256-bc/

    Why Choose YINCAE Solder Joint Encapsulants SMT 256 BC?Key Applications YINCAE Solder Joint Encapsulants SMT 256 BC is a cutting-edge

    YINCAE Solder Joint Encapsulants SMT 138
    YINCAE Solder Joint Encapsulants SMT 138
    https://prostech.vn/yincae-solder-joint-encapsulants-smt-138/

    Key Features of YINCAE Solder Joint Encapsulants SMT 138Versatile Applications YINCAE Solder Joint Encapsulants SMT 138 is a cutting-edge, low-temperature

    Similar Products

    • Huntsman

      ARALDITE LY 30030 CI / ARADUR 30031

      See details
    • Huntsman

      ARALDITE LY 30012 CI / ARADUR 30013

      See details
    • Huntsman

      ARALDITE 1564 / ARADUR 3474

      See details
    • Huntsman

      ARALDITE LY 3588/ ARADUR 3588

      See details
    Araldite 2014-1 Two component epoxy paste adhesive

      Leave your information via Form, our Technical Support Team will contact you shortly!

      Araldite 2014-1 Two component epoxy paste adhesive

        Leave your information via Form, our Technical Support Team will contact you shortly!

        Araldite 2014-1 Two component epoxy paste adhesive

          Leave your information via Form, our Technical Support Team will contact you shortly!

          Araldite 2014-1 Two component epoxy paste adhesive

            Leave your information via Form, our Technical Support Team will contact you shortly!

            Specialty Materials & Manufacturing Solutions

            • Home
            • Products
            • Solutions
            • Industries
            • Resource
            • Contact

            Follow Us

            © 2021 Prostech. All rights reserved.

            Asking for Product Information and Technical Consultant

              Leave your information via Form, our Technical Support Team will contact you shortly!