AOCHUAN TECHNOLOGY TP500-H50-FG High Thermal Conductivity Gap Filler Pad

Product Description

• This specialized gap filler pad, named TP500-H50-FG, provides exceptional thermal management solutions for a wide array of electronic devices.
• Manufactured by AOCHUAN TECHNOLOGY, it boasts a high thermal conductivity of 5.0 W/mK, effectively drawing heat away from critical components.
• Designed with fiberglass reinforcement, this pad offers enhanced durability and anti-piercing capabilities for reliable long-term performance.
• Its naturally tacky surface on both sides simplifies application in high-volume production environments, ensuring secure placement.
• Engineered to withstand elevated temperatures, it maintains stable thermal performance across challenging operational conditions.

Key Features

• Achieves 5.0 W/mK thermal conductivity
• Fiberglass reinforced construction for enhanced durability
• Naturally tacky on both surfaces for easy application
• Ideal for high volume manufacturing applications
• Resistant to elevated operating temperatures
• Offers excellent electrical insulation performance
• Suitable for a wide range of consumer electronics