AOCHUAN TECHNOLOGY TP1200 High Thermally Conductive Gap Filler Pad

Product Description

• This premium thermal interface material from AOCHUAN TECHNOLOGY excels at bridging air gaps between hot components and heat sinks, ensuring efficient heat transfer.
• Engineered to deliver exceptional thermal conductivity at 12.0W/m·K, it significantly improves the cooling performance of electronic devices.
• Possessing high electrical insulation and a wide operational temperature range, this pad offers robust and reliable performance in various challenging environments.
• Its high compression ratio allows for excellent conformity to irregular surfaces, making it ideal for critical applications like VRMs, ASICs, network devices, and BGAs.
• Designed for demanding electronics, it prevents overheating and extends the lifespan of components in devices from CD/DVD ROMs to complex communication systems.

Key Features

• Exceptional thermal conductivity: 12.0 W/m·K
• Superior electrical insulation properties
• Broad operating temperature range (-40°C to 150°C)
• Excellent compressibility for gap filling
• UL 94 V-0 flammability rating