AOCHUAN TECHNOLOGY TP 300-S

Product Description

• This advanced AOCHUAN TECHNOLOGY gap filler pad is specifically designed to manage thermal challenges in electronics, offering superior heat dissipation.
• Engineered to excel with elevated temperature resistance, it provides reliable thermal management for components operating in harsh conditions.
• As a soft and electrically conductive solution, it bridges thermal gaps effectively, ensuring optimal heat transfer away from critical parts like graphic cards.
• Crafted from a ceramic filler and silicone composition, this pad offers excellent compliance and conformability to irregular surfaces.
• Ideal for a wide array of typical applications requiring robust thermal conductivity and consistent performance under high thermal stress.

Key Features

• Elevated temperature resistance
• Soft and conductive design
• Excellent thermal conductivity
• Ceramic filler + silicone composition
• Light blue visual appearance
• UL 94 V-0 flammability rating