This highly effective two-part liquid gap filler, developed by AOCHUAN TECHNOLOGY, is meticulously engineered to provide outstanding thermal conductivity in critical electronic assemblies.
Designed for seamless application, it functions as a low volatile thermal conductive adhesive, forming a robust, cured product similar to a thermal gasket when mixed and cured at room temperature.
It boasts an impressive thermal conductivity of 3.5 W/mK, ensuring efficient heat dissipation from various components, effectively transferring heat to a sink.
Its advanced formulation guarantees remarkable mechanical and chemical stability across a wide operational temperature range, from -40°C to 150°C, while also meeting stringent UL 94 V-0 flame retardant standards.
This product is ideally suited for demanding uses in modern vehicle electronics, SSDs, fiber optic communication devices, and various network communication equipment where low compression force applications are critical.
Key Features
Exceptional thermal conductivity: 3.5 W/m·K
Curing time is adjustable to fit specific production needs
Superior mechanical and chemical stability over broad temperatures
Optimized for low compression force applications
Features very low volatility for sustained performance
Convenient two-part A/B component mixing at 1:1 ratio
Reliable room temperature curing process
Complies with UL 94 V-0 flame retardant grade requirements
