3M™ Thermally Conductive Silicone Interface Pad 5591 is designed to provide a preferential heat transfer path between heat generating components and heat sinks, heat spreaders or other cooling devices. 3M™ Thermally Conductive Silicone Interface Pad 5591 consists of a highly conformable and slightly tacky silicone elastomer sheet filled with thermally conductive ceramic particles, which helps provides enhanced thermal conductivity and excellent electrical insulation performance.
FEATURES
- Very good softness and conformability even to non-flat surfaces
- Good thermal conductivity
- Good electrical insulation properties
- Compression relaxation properties help reduce pressure to electric components
- Slight tack allows pre-assembly
- Good wettability for improved and lower thermal resistance
APPLICATIONS
- Integrated chip (IC) packaging heat conduction
- Heat sink interface
- Chip on film (COF) heat conduction
- LED board thermal interface material (TIM)
- HDTV integrated chip (IC)
- General gap filling in electronic device
| Property | Values | Unit | Test Method |
| Color | White | – | Visual |
| Thermal Conductivity | 1.0 | W/m-K | ASTM D5470 |
| Density 25°C | 2.0 | g/cm3 | ASTM D6111 |
| Operating Temperature Range | -50 to 125 | °C | 3M test method |
| Hardness Shore 00 | 10 ~ 15 | Modified ASTM D2240 | |
| Dielectric Breakdown | 8 | KV/mm | Modified ASTM D149 |
| Volume Resistivity | 2 x 1012 | Ohms | ASTM D257 |
| UL Flammability Rating | 3M VØ | – | – |
| Shelf Life | 12 | months | – |
