3M™ Thermally Conductive Acrylic Interface Pad 5571 is a moderately conformable and medium-soft pad with high thermal conductivity of 2.0 W/m-K (ASTM C113). This pad consists of a slightly tacky acrylic elastomeric sheet filled with thermally conductive ceramic particles. It is designed to transfer heat from heat generating components to heat sinks and cooling devices, improving device reliability, and extending the component’s life.
Key Features
- High thermal conductivity, 2.0 W/m-K on plane direction
- Good softness and conformability even to non-flat IC surfaces and heat spreading blocks
- Passes UL 94 V-0 flame retardance test
- No siloxane outgassing or oil bleeding
- Soft compliant material allows for pressure relaxation, preventing high pressure zones on components
- Good electrical insulation properties
- Slight tack allows easy pre-assembly
- Good wetting performance for better thermal conductivity
Applications
- Heat transfer between PCB and heat sink
- Decrease of compression stress to electronic parts by thermal pad softness
- Gap filling in electronic devices
- Chip on film (COF) heat dissipation
- Power electronic component thermal management
