• Products
    • By Application
      • Specialty Materials
      • Hidden
      • Hidden
      • Hidden
      • Adhesives
      • Tapes
      • Curing System
      • Converting Services
      • Abrasives
      • Conformal Coatings
      • Dispensing System
      • Material Formulation Customization
      • Elastomeric Materials
      • Electronics Auxiliary Chemicals
      • Low Pressure Molding Machine
      • Low Pressurea Molding Services
      • Electronic Staking/Fixing
      • Electronic Underfill
      • Metrology Equipment
      • Robotic & Automation
      • EMI Shielding
      • Impregnating resin
      • Tape Converter Machine
      • Package Customization
      • Immersion Cooling Fluids
      • Industrial Coating
      • Hidden
      • Labelling Printing
      • Low Pressure Molding
      • Hidden
      • Hidden
      • Lubricant
      • Insulation
      • Hidden
      • Hidden
      • Activator, Initiator & Accelerator
      • Cleaner Degreaser
      • Hidden
      • Hidden
      • Maintain and Repair
      • Temporary Masking
      • Hidden
      • Hidden
      • Thermal Management
      • Thinner Liquid
      • Hidden
      • Hidden
      • Potting – Encapsulant
      • Primer and Adhesion Promoter
      • Sealant & Gasketing Liquids
      • Soldering Materials
      • Hidden
      • Other Industrial Materials
    • By Market
      • Electronics
      • Transportation
      • Medical
      • Battery
      • Electrical
      • General Industrial
      • Handphone
      • Lighting
      • Packaging
      • Power
      • Semiconductor
      • Textile & Garment
      • Consumer Products
    • By Manufacturer
      • 3M
      • AB Chimie
      • Actnano
      • AETP
      • Almit
      • Aventek
      • Balver Zinn
      • Banseok
      • Bostik
      • Cartell
      • Chemtronics
      • Daheng
      • Denka
      • Dymax
      • Elantas
      • Everwide
      • EPO-TEK
      • Gluditec
      • H. B. Fuller
      • Henkel
      • Heraeus
      • Hexagon
      • Hikrobot
      • Humiseal
      • Huntsman
      • ITW Performance Polymers
      • Jones Tech
      • Jowat
      • Kester
      • Kuka
      • Kunshan Hexin
      • Lamieux
      • Markem imaje
      • Medmix
      • Metrology
      • MG Chemicals
      • Momentive
      • Nordson
      • Permabond
      • Peters
      • Prostech
      • Recochem
      • RedRing Solder
      • Rogers
      • Rozitek
      • Saint Gobain
      • Seayu
      • Shenmao
      • Shenzhen HFC
      • Shiu Li Lipoly
      • Somar Corp.
      • Stockmeier
      • Sulzer
      • t-Global
      • Techspray
      • Threebond
      • Toyobo
      • Vietape
      • Weldtone
      • Xetar
      • YINCAE
  • Solutions
    • Industrial Adhesive
    • Industrial Tape
    • Low Pressure Molding Solutions
    • Thermal Interface Materials Solutions
    • Conformal Coating Solution
    • Potting – Encapsulation Solutions
    • 3M Novec Alternatives
    • Automated Guided Vehicles (AGVs) solution
    • Automation System
    • Cleaning and Degreasing
    • Elastometric Solution
    • EMI Shielding Solutions
    • Impregnating
    • Liquid Media Curing
    • Printed Circuit Board Solutions
    • Single Component Dispensing System
    • Surface Treatment
    • Temporary Masking
  • Industries
    • Automotive Industry
    • Motor Industry
    • Battery Energy Storage System (BESS)
    • Furniture & Building Construction
    • Speaker
    • Image Sensor & Camera Module
    • Transformer
    • Medical
    • Construction
    • Electronics Industry
    • Sports and Fashion
  • Resource
    • Glossary
    • Video
    • Library
    • Blog
  • Contact
  • FAQ
Skip to content
site-logo

Search Result

  • Products
    • By Application
      • Specialty Materials
      • Hidden
      • Hidden
      • Hidden
      • Adhesives
      • Tapes
      • Curing System
      • Converting Services
      • Abrasives
      • Conformal Coatings
      • Dispensing System
      • Material Formulation Customization
      • Elastomeric Materials
      • Electronics Auxiliary Chemicals
      • Low Pressure Molding Machine
      • Low Pressurea Molding Services
      • Electronic Staking/Fixing
      • Electronic Underfill
      • Metrology Equipment
      • Robotic & Automation
      • EMI Shielding
      • Impregnating resin
      • Tape Converter Machine
      • Package Customization
      • Immersion Cooling Fluids
      • Industrial Coating
      • Hidden
      • Labelling Printing
      • Low Pressure Molding
      • Hidden
      • Hidden
      • Lubricant
      • Insulation
      • Hidden
      • Hidden
      • Activator, Initiator & Accelerator
      • Cleaner Degreaser
      • Hidden
      • Hidden
      • Maintain and Repair
      • Temporary Masking
      • Hidden
      • Hidden
      • Thermal Management
      • Thinner Liquid
      • Hidden
      • Hidden
      • Potting – Encapsulant
      • Primer and Adhesion Promoter
      • Sealant & Gasketing Liquids
      • Soldering Materials
      • Hidden
      • Other Industrial Materials
    • By Market
      • Electronics
      • Transportation
      • Medical
      • Battery
      • Electrical
      • General Industrial
      • Handphone
      • Lighting
      • Packaging
      • Power
      • Semiconductor
      • Textile & Garment
      • Consumer Products
    • By Manufacturer
      • 3M
      • AB Chimie
      • Actnano
      • AETP
      • Almit
      • Aventek
      • Balver Zinn
      • Banseok
      • Bostik
      • Cartell
      • Chemtronics
      • Daheng
      • Denka
      • Dymax
      • Elantas
      • Everwide
      • EPO-TEK
      • Gluditec
      • H. B. Fuller
      • Henkel
      • Heraeus
      • Hexagon
      • Hikrobot
      • Humiseal
      • Huntsman
      • ITW Performance Polymers
      • Jones Tech
      • Jowat
      • Kester
      • Kuka
      • Kunshan Hexin
      • Lamieux
      • Markem imaje
      • Medmix
      • Metrology
      • MG Chemicals
      • Momentive
      • Nordson
      • Permabond
      • Peters
      • Prostech
      • Recochem
      • RedRing Solder
      • Rogers
      • Rozitek
      • Saint Gobain
      • Seayu
      • Shenmao
      • Shenzhen HFC
      • Shiu Li Lipoly
      • Somar Corp.
      • Stockmeier
      • Sulzer
      • t-Global
      • Techspray
      • Threebond
      • Toyobo
      • Vietape
      • Weldtone
      • Xetar
      • YINCAE
  • Solutions
    • Industrial Adhesive
    • Industrial Tape
    • Low Pressure Molding Solutions
    • Thermal Interface Materials Solutions
    • Conformal Coating Solution
    • Potting – Encapsulation Solutions
    • 3M Novec Alternatives
    • Automated Guided Vehicles (AGVs) solution
    • Automation System
    • Cleaning and Degreasing
    • Elastometric Solution
    • EMI Shielding Solutions
    • Impregnating
    • Liquid Media Curing
    • Printed Circuit Board Solutions
    • Single Component Dispensing System
    • Surface Treatment
    • Temporary Masking
  • Industries
    • Automotive Industry
    • Motor Industry
    • Battery Energy Storage System (BESS)
    • Furniture & Building Construction
    • Speaker
    • Image Sensor & Camera Module
    • Transformer
    • Medical
    • Construction
    • Electronics Industry
    • Sports and Fashion
  • Resource
    • Glossary
    • Video
    • Library
    • Blog
  • Contact
  • FAQ
  • en
  • vi
  • cn
Home > Products > By Manufacturer > 3M > 3M™ Scotch-Weld™ > 3M™ Scotch-Weld™ Structural Adhesive Film AF 191
3M™ Scotch-Weld™ Structural Adhesive Film AF 191 Prostech Vietnam

3M™ Scotch-Weld™ Structural Adhesive Film AF 191

  • Product code: 3M™ AF 191
  • Manufacturer: 3M
  • Package size:
  • Shelf Life:
Request Quote Request Sample
  • Description
  • Specification
  • TDS/MSDS
  • Related Article
  • Product Introduction
  • 3M™ Scotch-Weld™ Structural Adhesive Film AF 191 Features
  • 3M™ Scotch-Weld™ Structural Adhesive Film AF 191 Applications
  • About Prostech

Product Introduction

3M™ Scotch-Weld™ Structural Adhesive Film AF 191 is a thermosetting modified epoxy adhesive in film form, engineered for long-term durability in metal and composite solid panel and honeycomb sandwich construction. Designed for a 350°F (175°C) cure, this adhesive can also be cured at temperatures as low as 275°F (135°C), offering process flexibility for aerospace applications. AF 191 delivers high fracture toughness, excellent peel strength, and superior elevated temperature performance, making it ideal for demanding structural bonding tasks.

This adhesive film is available in various weights and carriers to meet diverse manufacturing needs while maintaining cost efficiency. An unsupported version is offered for reticulation applications. AF 191 is compatible with multiple substrates and primers, including 3M™ Scotch-Weld™ Structural Adhesives Primer EW-5000, EW-5000 AS, and EC-3917. The film exhibits excellent pre-bond humidity performance on composite substrates and provides high bond strength across a wide temperature range from -67°F to 350°F (-55°C to 175°C). It is also available with a lightweight conductive screen for lightning strike protection and composite surfacing, further enhancing its versatility in aerospace manufacturing.

3M™ Scotch-Weld™ Structural Adhesive Film AF 191 Features

  • Designed for 350°F cure (175°C)
  • Adhesive can be cured from 275°F (135°C) up to 350°F (175°C)
  • Excellent elevated temperature performance
  • Unsupported version available for reticulation
  • High-fracture toughness and peel strength
  • Available with lightweight conductive screen for lightning strike protection and composite surfacing
  • Compatible with multiple 3M™ Scotch-Weld™ Structural Adhesives Primers
  • Excellent pre-bond humidity performance on composite substrates
  • Provides high bond strength from -67°F to 350°F (-55°C to 175°C)

3M™ Scotch-Weld™ Structural Adhesive Film AF 191 Applications

  • Bonding metal, composite, and honeycomb structures in aerospace manufacturing
  • Monolithic bonding and honeycomb sandwich construction
  • Applications requiring high fracture toughness and elevated temperature performance
  • Reticulation applications using unsupported versions
  • Structural bonding tasks requiring lightning strike protection with conductive screen versions
  • Adhesive bonding processes requiring compatibility with multiple primers and substrates
  • Production environments requiring high bond strength and minimal surface preparation

About Prostech

Prostech offers specialty materials (adhesives, tapes, thermal interface materials, insulating materials, sealants, PCB protection materials, …) along with manufacturing solutions. We proudly serve a wide range of industries and are an authorized distributor for leading global manufacturers of industrial materials and equipment. Our product range is designed to deliver customized solutions that address each customer’s unique needs.

With years of experience and a successful project history, we are confident in our ability to provide comprehensive material solutions. These solutions effectively tackle the challenges manufacturers face. To explore our full product catalog, simply click here. Our dedicated team is ready to assist with:

  • Provide quotation, sample, TDS/MSDS, and technical consultation
  • Testing sample quality and verifying product compatibility in our laboratory
  • Customizing material formulas for special applications
  • Adapting product sizes, quantities, and packaging to meet specific needs
  • Offering expert advice on suitable equipment and automation processes
  • Delivering technical training and on-site support for optimal product use

Moreover, Prostech ensures the safe and accurate global delivery of all materials, including “dangerous goods”, in compliance with legal regulations. For personalized technical support or to receive a quotation, please contact us today.

PropertyValue
Adhesive TypeEpoxy
ApplicationBonding
Cure Rate1 hr
Curing Temperature (Celsius)177 ℃
Curing Temperature (Fahrenheit)350 ℉
Maximum Cure Conditions (Celsius)200 ℃
Maximum Cure Conditions (Fahrenheit)400 ℉
Maximum Operating Temperature (Celsius)175 ℃
Maximum Operating Temperature (Fahrenheit)350 ℉
Minimum Cure Conditions (Celsius)135 ℃
Minimum Cure Conditions (Fahrenheit)275 ℉
Minimum Operating Temperature (Celsius)-55 ℃
Minimum Operating Temperature (Fahrenheit)-67 ℉
Nominal Adhesive Thickness (Imperial)2.5 mil, 6 mil, 8 mil, 10 mil, 13 mil, 16 mil
Nominal Adhesive Thickness (Metric)0.064 mm, 0.152 mm, 0.203 mm, 0.254 mm, 0.33 mm, 0.406 mm
Nominal Weight (Imperial)0.015 lb/ft², 0.03 lb/ft², 0.035 lb/ft², 0.055 lb/ft², 0.06 lb/ft², 0.08 lb/ft², 0.1 lb/ft²
Product ColorTan
Product FormRoll
Storage EnvironmentFreezer Storage
SubstrateMetal, Composite
Overall Length (Imperial)18 yd, 25 yd, 36 yd, 40 yd, 50 yd
Overall Length (Metric)16 m, 22.9 m, 33 m, 36.576 m, 45.7 m
Overall Width (Imperial)14 in, 18 in, 36 in, 42 in, 48 in
Overall Width (Metric)0.9 m, 1.1 m, 1.2 mm, 356 m, 457 mm

TDS:Download

Get MSDS

    Leave your information via Form, our Technical Support Team will contact you shortly!

    YINCAE Solder Joint Encapsulants SMT 266
    YINCAE Solder Joint Encapsulants SMT 266
    https://prostech.vn/yincae-solder-joint-encapsulants-smt-266/

    Key Features of YINCAE Solder Joint Encapsulants SMT 266Applications for YINCAE Solder Joint Encapsulants SMT 266 Introducing YINCAE Solder Joint

    YINCAE Solder Joint Encapsulants SMT 256
    YINCAE Solder Joint Encapsulants SMT 256
    https://prostech.vn/yincae-solder-joint-encapsulants-smt-256/

    Elevate Reliability with YINCAE Solder Joint Encapsulants SMT 256Key Features & BenefitsApplications of YINCAE Solder Joint Encapsulants SMT 256 YINCAE

    YINCAE Solder Joint Encapsulants SMT 256 BC
    YINCAE Solder Joint Encapsulants SMT 256 BC
    https://prostech.vn/yincae-solder-joint-encapsulants-smt-256-bc/

    Why Choose YINCAE Solder Joint Encapsulants SMT 256 BC?Key Applications YINCAE Solder Joint Encapsulants SMT 256 BC is a cutting-edge

    YINCAE Solder Joint Encapsulants SMT 138
    YINCAE Solder Joint Encapsulants SMT 138
    https://prostech.vn/yincae-solder-joint-encapsulants-smt-138/

    Key Features of YINCAE Solder Joint Encapsulants SMT 138Versatile Applications YINCAE Solder Joint Encapsulants SMT 138 is a cutting-edge, low-temperature

    Similar Products

    • YINCAE Solder Joint Encapsulants SMT 138

      YINCAE Solder Joint Encapsulants SMT 138

      See details
    • YINCAE Ball Attach Adhesive BP 256

      YINCAE Ball Attach Adhesive BP 256

      See details
    • AB Chimie Silicone TSE3941

      AB Chimie Silicone TSE3941

      See details
    • abchimie

      AB Chimie Silicone TSE399W

      See details
    3M™ Scotch-Weld™ Structural Adhesive Film AF 191

      Leave your information via Form, our Technical Support Team will contact you shortly!

      3M™ Scotch-Weld™ Structural Adhesive Film AF 191

        Leave your information via Form, our Technical Support Team will contact you shortly!

        3M™ Scotch-Weld™ Structural Adhesive Film AF 191

          Leave your information via Form, our Technical Support Team will contact you shortly!

          3M™ Scotch-Weld™ Structural Adhesive Film AF 191

            Leave your information via Form, our Technical Support Team will contact you shortly!

            Specialty Materials & Manufacturing Solutions

            • Home
            • Products
            • Solutions
            • Industries
            • Resource
            • Contact

            Follow Us

            © 2021 Prostech. All rights reserved.

            Asking for Product Information and Technical Consultant

              Leave your information via Form, our Technical Support Team will contact you shortly!