• Products
    • By Application
      • Specialty Materials
      • Hidden
      • Hidden
      • Hidden
      • Adhesives
      • Tapes
      • Curing System
      • Converting Services
      • Abrasives
      • Conformal Coatings
      • Dispensing System
      • Material Formulation Customization
      • Elastomeric Materials
      • Electronics Auxiliary Chemicals
      • Low Pressure Molding Machine
      • Low Pressurea Molding Services
      • Electronic Staking/Fixing
      • Electronic Underfill
      • Metrology Equipment
      • Robotic & Automation
      • EMI Shielding
      • Impregnating resin
      • Tape Converter Machine
      • Package Customization
      • Immersion Cooling Fluids
      • Industrial Coating
      • Hidden
      • Labelling Printing
      • Low Pressure Molding
      • Hidden
      • Hidden
      • Lubricant
      • Insulation
      • Hidden
      • Hidden
      • Activator, Initiator & Accelerator
      • Cleaner Degreaser
      • Hidden
      • Hidden
      • Maintain and Repair
      • Temporary Masking
      • Hidden
      • Hidden
      • Thermal Management
      • Thinner Liquid
      • Hidden
      • Hidden
      • Potting – Encapsulant
      • Primer and Adhesion Promoter
      • Sealant & Gasketing Liquids
      • Soldering Materials
      • Hidden
      • Other Industrial Materials
    • By Market
      • Electronics
      • Transportation
      • Medical
      • Battery
      • Electrical
      • General Industrial
      • Handphone
      • Lighting
      • Packaging
      • Power
      • Semiconductor
      • Textile & Garment
      • Consumer Products
    • By Manufacturer
      • 3M
      • AB Chimie
      • Actnano
      • AETP
      • Almit
      • Aventek
      • Balver Zinn
      • Banseok
      • Bostik
      • Cartell
      • Chemtronics
      • Daheng
      • Denka
      • Dymax
      • Elantas
      • Everwide
      • EPO-TEK
      • Gluditec
      • H. B. Fuller
      • Henkel
      • Heraeus
      • Hexagon
      • Hikrobot
      • Humiseal
      • Huntsman
      • ITW Performance Polymers
      • Jones Tech
      • Jowat
      • Kester
      • Kuka
      • Kunshan Hexin
      • Lamieux
      • Markem imaje
      • Medmix
      • Metrology
      • MG Chemicals
      • Momentive
      • Nordson
      • Permabond
      • Peters
      • Prostech
      • Recochem
      • RedRing Solder
      • Rogers
      • Rozitek
      • Saint Gobain
      • Seayu
      • Shenmao
      • Shenzhen HFC
      • Shiu Li Lipoly
      • Somar Corp.
      • Stockmeier
      • Sulzer
      • t-Global
      • Techspray
      • Threebond
      • Toyobo
      • Vietape
      • Weldtone
      • Xetar
      • YINCAE
  • Solutions
    • Industrial Adhesive
    • Industrial Tape
    • Low Pressure Molding Solutions
    • Thermal Interface Materials Solutions
    • Conformal Coating Solution
    • Potting – Encapsulation Solutions
    • 3M Novec Alternatives
    • Automated Guided Vehicles (AGVs) solution
    • Automation System
    • Cleaning and Degreasing
    • Elastometric Solution
    • EMI Shielding Solutions
    • Impregnating
    • Liquid Media Curing
    • Printed Circuit Board Solutions
    • Single Component Dispensing System
    • Surface Treatment
    • Temporary Masking
  • Industries
    • Automotive Industry
    • Motor Industry
    • Battery Energy Storage System (BESS)
    • Furniture & Building Construction
    • Speaker
    • Image Sensor & Camera Module
    • Transformer
    • Medical
    • Construction
    • Electronics Industry
    • Sports and Fashion
  • Resource
    • Glossary
    • Video
    • Library
    • Blog
  • Contact
Skip to content
site-logo

Search Result

  • Products
    • By Application
      • Specialty Materials
      • Hidden
      • Hidden
      • Hidden
      • Adhesives
      • Tapes
      • Curing System
      • Converting Services
      • Abrasives
      • Conformal Coatings
      • Dispensing System
      • Material Formulation Customization
      • Elastomeric Materials
      • Electronics Auxiliary Chemicals
      • Low Pressure Molding Machine
      • Low Pressurea Molding Services
      • Electronic Staking/Fixing
      • Electronic Underfill
      • Metrology Equipment
      • Robotic & Automation
      • EMI Shielding
      • Impregnating resin
      • Tape Converter Machine
      • Package Customization
      • Immersion Cooling Fluids
      • Industrial Coating
      • Hidden
      • Labelling Printing
      • Low Pressure Molding
      • Hidden
      • Hidden
      • Lubricant
      • Insulation
      • Hidden
      • Hidden
      • Activator, Initiator & Accelerator
      • Cleaner Degreaser
      • Hidden
      • Hidden
      • Maintain and Repair
      • Temporary Masking
      • Hidden
      • Hidden
      • Thermal Management
      • Thinner Liquid
      • Hidden
      • Hidden
      • Potting – Encapsulant
      • Primer and Adhesion Promoter
      • Sealant & Gasketing Liquids
      • Soldering Materials
      • Hidden
      • Other Industrial Materials
    • By Market
      • Electronics
      • Transportation
      • Medical
      • Battery
      • Electrical
      • General Industrial
      • Handphone
      • Lighting
      • Packaging
      • Power
      • Semiconductor
      • Textile & Garment
      • Consumer Products
    • By Manufacturer
      • 3M
      • AB Chimie
      • Actnano
      • AETP
      • Almit
      • Aventek
      • Balver Zinn
      • Banseok
      • Bostik
      • Cartell
      • Chemtronics
      • Daheng
      • Denka
      • Dymax
      • Elantas
      • Everwide
      • EPO-TEK
      • Gluditec
      • H. B. Fuller
      • Henkel
      • Heraeus
      • Hexagon
      • Hikrobot
      • Humiseal
      • Huntsman
      • ITW Performance Polymers
      • Jones Tech
      • Jowat
      • Kester
      • Kuka
      • Kunshan Hexin
      • Lamieux
      • Markem imaje
      • Medmix
      • Metrology
      • MG Chemicals
      • Momentive
      • Nordson
      • Permabond
      • Peters
      • Prostech
      • Recochem
      • RedRing Solder
      • Rogers
      • Rozitek
      • Saint Gobain
      • Seayu
      • Shenmao
      • Shenzhen HFC
      • Shiu Li Lipoly
      • Somar Corp.
      • Stockmeier
      • Sulzer
      • t-Global
      • Techspray
      • Threebond
      • Toyobo
      • Vietape
      • Weldtone
      • Xetar
      • YINCAE
  • Solutions
    • Industrial Adhesive
    • Industrial Tape
    • Low Pressure Molding Solutions
    • Thermal Interface Materials Solutions
    • Conformal Coating Solution
    • Potting – Encapsulation Solutions
    • 3M Novec Alternatives
    • Automated Guided Vehicles (AGVs) solution
    • Automation System
    • Cleaning and Degreasing
    • Elastometric Solution
    • EMI Shielding Solutions
    • Impregnating
    • Liquid Media Curing
    • Printed Circuit Board Solutions
    • Single Component Dispensing System
    • Surface Treatment
    • Temporary Masking
  • Industries
    • Automotive Industry
    • Motor Industry
    • Battery Energy Storage System (BESS)
    • Furniture & Building Construction
    • Speaker
    • Image Sensor & Camera Module
    • Transformer
    • Medical
    • Construction
    • Electronics Industry
    • Sports and Fashion
  • Resource
    • Glossary
    • Video
    • Library
    • Blog
  • Contact
  • en
  • vi
  • cn
Home > Products > By Manufacturer > 3M > 3M™ Scotch-Weld™ > 3M Scotch-Weld Structural Adhesive Film AF 163-2
3M™ Scotch-Weld™ Structural Adhesive Film AF 163-2 Prostech Vietnam

3M Scotch-Weld Structural Adhesive Film AF 163-2

  • Product code: 3M AF 163-2
  • Manufacturer: 3M
  • Package size:
  • Shelf Life:
Request Quote Request Sample
  • Description
  • Specification
  • TDS/MSDS
  • Related Article
  • Product Introduction of 3M Scotch-Weld Structural Adhesive Film AF 163-2
  • Key Features
  • Key Applications
  • About Prostech

Product Introduction of 3M Scotch-Weld Structural Adhesive Film AF 163-2

Our 3M Scotch-Weld Structural Adhesive Film AF 163-2 encompasses a family of thermosetting modified epoxy adhesives in film form that delivers long-term durability and addresses specific challenges for metal and composite solid panel and honeycomb sandwich construction, where high fracture toughness and peel strength are essential. Designed for 250°F (120°C) cure, this adhesive film can also be cured within a broad range from 180°F (80°C) to 300°F (150°C), offering excellent shop handling characteristics and pre-bond humidity performance on composite substrates.

3M™ Scotch-Weld™ Structural Adhesive Film AF 163-2 is available in a variety of weights and carriers to meet diverse application needs while helping control material costs. It also includes an unsupported version for reticulation purposes. Compatible with multiple substrates and 3M primers, it delivers reliable, high-strength bonding performance. The adhesive offers high fracture toughness and peel strength across a wide range of environmental conditions, with excellent bonding from -67°F to 250°F (-55°C to 121°C).

This thermosetting epoxy film is a clean, efficient solution for bonding metals, composites, and honeycomb materials, minimizing the use of mechanical fasteners such as rivets. Supported versions are ideal for monolithic bonding or honeycomb sandwich structures, while unsupported versions are suitable for reticulation onto honeycomb cores. The film’s ease of handling, wide cure range, and reduced mess compared to liquid adhesives make it highly efficient for aerospace structural applications.

Key Features

  • Designed for 250°F (120°C) cure
  • Adhesive can be cured from 180°F (80°C) up to 300°F (150°C)
  • Excellent shop handling characteristics
  • Excellent pre-bond humidity performance on composite substrates
  • Unsupported version available for reticulation
  • High-fracture toughness and peel strength
  • Compatible with a variety of 3M™ Scotch-Weld™ Structural Adhesives Primers
  • Provides high bond strength across various temperatures and environments
  • Minimizes the need for mechanical fasteners in structural designs

Key Applications

  • Bonding metal, honeycomb, and composite structures in aerospace manufacturing
  • Honeycomb sandwich construction for lightweight structural designs
  • Solid panel bonding for both metal and composite substrates
  • Applications requiring high fracture toughness and peel strength under demanding conditions
  • Use in reticulation processes with unsupported film versions
  • Replacing mechanical fasteners for improved structural integrity and weight reduction
  • Composite bonding where clean application and minimal mess are required

About Prostech

Prostech offers specialty materials (adhesives, tapes, thermal interface materials, insulating materials, sealants, PCB protection materials, …) along with manufacturing solutions. We proudly serve a wide range of industries and are an authorized distributor for leading global manufacturers of industrial materials and equipment. Our product range is designed to deliver customized solutions that address each customer’s unique needs.

With years of experience and a successful project history, we are confident in our ability to provide comprehensive material solutions. These solutions effectively tackle the challenges manufacturers face. To explore our full product catalog, simply click here. Our dedicated team is ready to assist with:

  • Provide quotation, sample, TDS/MSDS, and technical consultation
  • Testing sample quality and verifying product compatibility in our laboratory
  • Customizing material formulas for special applications
  • Adapting product sizes, quantities, and packaging to meet specific needs
  • Offering expert advice on suitable equipment and automation processes
  • Delivering technical training and on-site support for optimal product use

Moreover, Prostech ensures the safe and accurate global delivery of all materials, including “dangerous goods”, in compliance with legal regulations. For personalized technical support or to receive a quotation, please contact us today.

PropertyValue
Adhesive TypeEpoxy
ApplicationBonding
Cure Rate90 min
Curing Temperature (Celsius)121 ℃
Curing Temperature (Fahrenheit)250 ℉
Factory ISO CertificationNo ISO Certification information available
Maximum Cure Conditions (Celsius)121 ℃
Maximum Cure Conditions (Fahrenheit)250 ℉
Maximum Operating Temperature (Celsius)121 ℃
Maximum Operating Temperature (Fahrenheit)250 ℉
Minimum Cure Conditions (Celsius)107 ℃
Minimum Cure Conditions (Fahrenheit)225 ℉
Minimum Operating Temperature (Celsius)-55 ℃
Minimum Operating Temperature (Fahrenheit)-67 ℉
Nominal Adhesive Thickness (Imperial)2.5 mil, 5.5 mil, 7.5 mil, 9.5 mil, 13 mil
Nominal Adhesive Thickness (Metric)0.064 mm, 0.14 mm, 0.191 mm, 0.241 mm, 0.33 mm
Nominal Weight (Imperial)0.015 lb/ft², 0.03 lb/ft², 0.045 lb/ft², 0.06 lb/ft², 0.085 lb/ft²
Product ColorRed, Pink, Green, Yellow, Blue, Tan
Product FormRoll
Storage EnvironmentFreezer Storage
SubstrateComposite, Metal
Dimensions and Classifications
Overall Length (Imperial)2 yd, 36 yd, 50 yd, 60 yd, 63 yd
Overall Length (Metric)1.8 m, 33 m, 45.7 m, 54.9 m, 57 m
Overall Width (Imperial)0.38 in, 0.4375 in, 0.75 in, 1.125 in, 2.25 in, 2.3125 in, 3.5 in, 4.5 in, 5 in, 5.75 in, 6.3125 in, 10.5 in, 12 in, 18 in, 36 in, 40 in, 48 in
Overall Width (Metric)0.9 m, 1 mm, 1.2 mm, 10 mm, 11 m, 19 mm, 29 mm, 57 mm, 59 mm, 89 mm, 114 mm, 127 mm, 146 mm, 160 mm, 267 mm, 305 mm, 457 m, 914.4 mm

TDS:Download

Get MSDS

    Leave your information via Form, our Technical Support Team will contact you shortly!

    YINCAE-industrial-materials
    Yincae Conductive DA 90
    https://prostech.vn/yincae-conductive-da-90/

    General Information of Yincae Conductive DA 90Key Features of Yincae Conductive DA 90Key Applications Yincae Conductive DA 90 is an

    YINCAE-industrial-materials
    Yincae Conductive DA 90-50
    https://prostech.vn/yincae-conductive-da-90-50/

    General Information of Yincae Conductive DA 90-50Key Features of Yincae Conductive DA 90-50Key Applications Yincae Conductive DA 90-50 is an

    YINCAE-industrial-materials
    Yincae Conductive DA 120F
    https://prostech.vn/yincae-conductive-da-120f/

    General Information of Yincae Conductive DA 120FKey Features of Yincae Conductive DA 120FKey Applications Yincae Conductive DA 120F is a

    YINCAE-industrial-materials
    Yincae Solderable Conductive Diamond-Filled TM 158D
    https://prostech.vn/yincae-solderable-conductive-diamond-filled-tm-158d/

    General Information of Yincae Solderable Conductive Diamond-Filled TM 158DKey Features of Yincae Solderable Conductive Diamond-Filled TM 158DKey Applications Yincae Solderable

    Similar Products

    • YINCAE-industrial-materials

      Yincae Optical Bonding WL 66L

      See details
    • YINCAE-industrial-materials

      Yincae LCD Sealant LACD 66F

      See details
    • YINCAE-industrial-materials

      Yincae Conductive DA 90

      See details
    • YINCAE-industrial-materials

      Yincae Conductive DA 120F

      See details
    3M Scotch-Weld Structural Adhesive Film AF 163-2

      Leave your information via Form, our Technical Support Team will contact you shortly!

      3M Scotch-Weld Structural Adhesive Film AF 163-2

        Leave your information via Form, our Technical Support Team will contact you shortly!

        3M Scotch-Weld Structural Adhesive Film AF 163-2

          Leave your information via Form, our Technical Support Team will contact you shortly!

          3M Scotch-Weld Structural Adhesive Film AF 163-2

            Leave your information via Form, our Technical Support Team will contact you shortly!

            Specialty Materials & Manufacturing Solutions

            • Home
            • Products
            • Solutions
            • Industries
            • Resource
            • Contact

            Follow Us

            © 2021 Prostech. All rights reserved.

            Asking for Product Information and Technical Consultant

              Leave your information via Form, our Technical Support Team will contact you shortly!