3M™ Low Static, Non-Silicone Polyimide Film Tape 7419 is designed for masking or protecting surfaces during soldering operations or other very high temperature processes where clean, residue free removal is desired. 3M tape 7419 utilizes a non-silicone adhesive formulation which eliminates concerns about silicone contamination on the masked areas. It also has designed in static dissipative performance attributes and produces very low static charge during unwind and removal making it desirable in static sensitive applications. 3M tape 7419 has been designed to remove cleanly from a variety of typical electronic substrates including FR-4, polyimide, gold, copper, and silicon after high temperature processing.
FEATURES
Specially formulated acrylic adhesive is resistant to typical solder mask temperatures for short periods of time.
Stays firmly in place during processing and removes cleanly from typical electronic substrates even after 10 min @ 500°F (260°C).
Non-silicone adhesive formulation eliminates the potential for silicone contamination which can interfere with subsequent bonding or conformal coating operations.
Includes designed in static dissipative attributes to manage static levels produced during roll unwind and removal from board after processing.
The high temperature acrylic adhesive also has excellent chemical resistance and
should be considered for demanding chemical masking applications.
APPLICATIONS
Masking or protecting residue sensitive areas on printed circuit boards during high temperature operations such as wave soldering and solder reflow.
