Ti900 Thermally Conductive Insulators

Ti900 is a high thermal performance insulator pad designed to maximize thermal conductivity and electrical isolation performance for a wide variety of applications. The unique formulation offers a smooth and compliant surface which minimizes interfacial thermal resistance at low mounting forces.

FEATURES

High insulation strength
Low thermal resistance
Die cut for custom shapes
Easy to assemble

APPLICATIONS

Electronic components: IC, CPU, MOS
LED, M/B, P/S, Heat Sink
LCD, TV, Notebook PC, PC Telecom Device, Wireless, etc.
DDR II Module, DVD Applications, Hand-set applications, etc.

Property	Ti900	Unit	Test Method
Viscose	One Side	–	ASTM D374
Thickness	0.12	mm	–
Base	RITF	–	–
Thermal Conductivity	1.8	W/mK	ASTM D5470
Thermal Resistance @ 10psi	0.50	K in²/W	ASTM D5470
Thermal Resistance @ 30psi	0.42	K in²/W	ASTM D5470
Thermal Resistance @ 50psi	0.35	K in²/W	ASTM D5470
Thermal Resistance @ 100psi	0.29	K in²/W	ASTM D5470
Thermal Resistance @ 200psi	0.28	K in²/W	ASTM D5470
Thermal Resistance @ 400psi	0.27	K in²/W	ASTM D5470
Insulation Strength Vac, V	›6000	–	ASTM D149
Volume Resistance	›10¹²	Ohm-cm	ASTM D257
Working Temperature	-50 to 180	oc	–
Tensile Strength	5000	psi	ASTM D412
Elongation	40	%	ASTM D412
Flammability Rating	V-0	–	UL94
Shelf Life	36	months	–
Shelf Life with adhesive (can be requalified for further 12)	12	months	–

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