TGPK27P is a light pink coloured, thermally conductive phase change (PCM) material. It is a solid at room temperature but changes phase at 55°C which allows it to wet surfaces. TGPK27P is supplied in an easy to use format so that it can be manually applied to a wide range of surfaces. The unique formulation gives an exceptionally low thermal resistance for heat transfer in the most demanding of applications.
FEATURES
Designed to maximize heat sink performance and improve component reliability
Displaces entrapped air between power-dissipating electronic components
Bond Line Thickness (BLT) of 0.0254mm
Practically no thermal contact resistance due to a very small thermal resistance path
Solid at room temperature for ease of application
Consistently and cleanly applied as dry pads to a heat sink or component surface
