Home > Products > By Market > Consumer Products > TGKSTIM9K Silicone Thermal Pad

TGKSTIM9K Silicone Thermal Pad

  • Product code: TGKSTIM9K
  • Manufacturer: T-Global
  • Package size:
  • Shelf Life: 36 months

Request Quote Request Sample

TGKSTIM9K is a black coloured silicone thermal pad, suitable for use as thermal interface material or a heat sink to dissipate the heat from electronic devices, especially in integrated circuits (IC) and LEDs packaging. TGKSTIM9K has a low hardness and elasticity, with high temperature resistance and good electrical insulation.

FEATURES

  • Highly compressible
  • Naturally tacky
  • Low oil bleed
  • Electrically insulating

APPLICATIONS

  • Electronic components: IC, CPU, MOS
  • LED, M/B, P/S, Heat Sink
  • LCD, TV, Notebook PC, PC Telecom Device, Wireless Hub, etc.
  • DDR II Module, DVD Applications, Hand-set applications, etc.
     
Property TGKSTIM9KUnitToleranceTest Method
Binder Silicone–––
ColourBlack––Visual
Reinforcement None–––
Specific Gravity1.2–––
Thermal Conductivity 0.9W/mK–ASTM D5470
Hardness 37Shore A–ASTM D4120
FlammabilityV-0––UL94
Operating Temperature -45 to 200 ˚C–ASTM D412
Shelf Life 36months––
Shelf Life with adhesive
(can be requalified for further 12) 		12months––

TDS:Download

Get MSDS

    Please leave your information and we'll get back to you shortly!







    data center costs
    How thermal management materials can lower your data center costs
    https://prostech.vn/how-thermal-management-materials-can-lower-your-data-center-costs/

    How Thermal Management Materials Reduce Heat?Micro thermal interface coatingsPhase-Change Materials (PCM)Thermal GreasesThermal GelThermal PadsThermal conductive adhesives (TCA)Optimizing ROI of Thermal

    Assembly and protecting applications for Data center infrastructure
    https://prostech.vn/assembly-and-protecting-applications-for-data-center-infrastructure/

    Thermal Interface Materials (TIMs) for data center infrastructureLens active alignment materials for data center infrastructureEpoxy and acrylic adhesives for structural

    Thermal Interface Material (TIMs) Solutions for Data Centers
    https://prostech.vn/thermal-interface-material-tims-solutions-for-high-performance-data-centers/

    The challenge with current solutionsWhy effective thermal interface materials (TIMs) solution matter in data centersThe application of TIMs solution for

    Data Center: Addressing the 4 key challenges
    https://prostech.vn/data-center-addressing-the-4-key-challenges-to-optimize-performance/

    1. The challenge: Rising heat and power densities in data centerThe solution: Advanced thermal management solution2. The challenge: Operational cost