TG2030 Ultra Soft Thermal Conductive Pad

TG2030 is an ultra-soft, silicone based thermal interface material. TG2030 has a low thermal impedance, conforms readily to surfaces due to its low hardness and provides a high dielectric breakdown voltage. TG2030 can be provided in various thicknesses and formats, such as custom die cuts, standard sheets or log rolls depending on the end application.

FEATURES

Ultra-Soft and high compressibility
Naturally tacky
Low oil bleed
Electrically insulating
As a buffer in electronics
Decrease the defect rate of the electronics

APPLICATIONS

Electronic components: IC, CPU, MOS
LED, M/B, P/S, Heat Sink LCD, TV, Notebook PC, PC Telecom Device, Wireless Hub, etc.
DDR II Module, DVD Applications, Hand-set applications, etc.

Property	TG2030	Unit	Tolerance	Test Method
Colour	White	–	–	Visual
Thickness (Available thickness range)	0.5 – 5.0	mm	–	ASTM D374
Thickness (Available thickness range)	0.0197 – 0.1969	inch	–	ASTM D374
Thermal Conductivity	2	W/mK	±0.2	ASTM D5470
Flammability Rating	V-0	–	–	UL 94
Dielectric Breakdown Voltage	16	kV/mm	±1.6	ASTM D149
Weight Loss	‹1	%	–	ASTM E595
Density	2.4	g/cm³	±0.2	ASTM D792
Working Temperature	-45 to 200	˚C	–	–
Volume Resistance ›10¹² Ohm-cm – ASTM D257	›10¹²	Ohm-cm	–	ASTM D257
Elongation	300	%	–	ASTM D412
Tensile Strength	1	Kgf/cm²	–	ASTM D412
Hardness 30	30	Shore 00	±10	ASTM D2240
Shelf Life	36	months	–	–
Shelf Life with adhesive (can be requalified for further 12)	12	months	–	–

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TG2030 Ultra Soft Thermal Conductive Pad

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