TG-X Ultra Soft Thermal Conductive Pad

TG-X is high performance silicone gap filler with a thermal conductivity of 12 W/mk. TG-X is highly conformable and can be supplied in either standard sheets or custom die-cut parts. TG-X is formulated to wet most surfaces and provide low thermal impedance for the most demanding of applications.

FEATURES

High-end product with thermal conductivity of 12 W/mK
Highly compressible
Naturally tacky
Low Shore 00 hardness
Low oil bleed
Electrically insulating

APPLICATIONS

Electronic components: IC, CPU, MOS
LED, M/B, P/S, Heat Sink
LCD, TV, Notebook PC, PC Telecom Device, Wireless Hub, etc.
DDR II Module, DVD Applications, Hand-set applications, etc.

Property	TG-X	Unit	Tolerance	Test Method
Colour	Grey	–	–	Visual
Thickness (Available thickness range)	0.5 – 2.0	mm	–	ASTM D374
Thickness (Available thickness range)	0.0197 – 0.0787	inch	–	ASTM D374
Thermal Conductivity	12	W/mK	±1.2	ASTM D5470
Flammability Rating	V-0	–	–	UL 94
Dielectric Breakdown Voltage	12	kV/mm	±1.2	ASTM D149
Weight Loss	‹1	%	–	ASTM E595
Density	3.4	g/cm³	±0.2	ASTM D792
Working Temperature	-45 to 200	˚C	–	–
Volume Resistance	›10¹¹	Ohm-cm	–	ASTM D257
Standard Shape	320-320mm	Sheets	–	–
Hardness	65	Shore 00	±15	ASTM D2240
Shelf Life	36	months	–	–
Shelf Life with adhesive (can be requalified for further 12)	12	months	–	–

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TG-X Ultra Soft Thermal Conductive Pad

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