By using a special process, we use the silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.
FEATURES:
- Very good thermal conductivity
- Fiberglass on one side
- Non deforming
- Electeical insulation
APPLICATION:
- Best for high power applications
- Electronic components: IC, CPU, MOS, LED, Mother Board, Power Supply, Heat Sink, LCD-TV, Notebook, PC, Telecom Device, Wireless
- Hub, DDR ll Module, DVD Applications, Handset applications, etc.
| Properties | TG-A3500F | Unit | Tolerance | Test Method |
| Thermal Conductivity | 3 | W / mK | ±10% | ASTM D5470 |
| Thickness | 0.5~ 8.0 | mm | – | ASTM D374 |
0.0197~ 0.315 | inch | – | ASTM D374 | |
| Color | yellow | – | – | Visual |
| Reinforcement Carrier | Fiberglass | – | – | – |
| Flame Rating | V-0 | – | – | UL 94 |
| Dielectric Breakdown Voltage | >6 | KV / mm | – | ASTM D149 |
| Weight Loss | <1 | % | – | ASTM E595 |
| Density | 2.3 | g / cm3 | – | ASTM D792 |
| Working Temperature | -50 ~ +150 | °C | – | – |
| Volume Resistance | 8×1012 | Ohm-m | – | ASTM D257 |
| Elongation | 80 | % | – | ASTM D412 |
| Standard Shape | Sheet ones | – | – | – |
| Hardness(Silicone side) | 30 | Shore 00 | ±15 | ASTM D2240 |