The G-series Solder Pastes are composed of ultra fine spherical solder power with a very low oxide content and a highly reliable flux
ALLOY COMPOSITION(%) | |
G220 | Sn(96.5%) Ag(3.0%) CuO(0.5%) |
G225 | Sn(96.3%) Ag(3.0%) CuO(0.7%) |
G107 | Sn(98.3%) Ag(1.0%) CuO(0.7%) |
G237 | Sn(99.0%) Ag(0.3%) CuO(0.7%) |
G187 | Sn64Bi35Ag1 |
POWDER SIZE | |
Code A | 25-45 μm |
Code B | 38-53 μm |
Code C | 20-38 μm |
Code D | 20-45 μm |
Code E | 45-75 μm |
Code F | 15-25 μm |