Product description
LiPOLY S-putty2-s Thermal Conductive Putty is a one-part dispensable material with thermal conductivity 6.0 W/m*K. High defor- mation can fill small air gaps perfectly to remove tolerance. It also can overcome overflow and drying problems to increase the thermal conductivity. S-putty2-s is a great alternative to thermal grease and ideally suited for dispensing using the dispensing robot.
Features of LiPOLY S-putty2-s Thermal Conductive Putty
- Thermal conductivity:6.0 W/m*K
- Bond line thickness:100-1500µm
- Designed to remove manufacturing tolerances
- Does not produce stress on delicate components
- No vertical flow
- Dispensable for serial manufacture
- For any high compression and low stress application
Applications of LiPOLY S-putty2-s Thermal Conductive Putty
- Between CPU and heat sink
- Between a component and heat sink
- High speed mass storage drives
- Telecommunication hardware
- Flat-panel displays
- Set-top box
- IP CAM
- 5G base station & infrastructure
- EV electric vehicle
Prostech offers specialty materials (adhesives, tapes, thermal interface materials, insulating materials, sealants, PCB protection materials, …) along with manufacturing solutions. We proudly serve a wide range of industries and are an authorized distributor for leading global manufacturers of industrial materials and equipment. Our product range is designed to deliver customized solutions that address each customer’s unique needs. With years of experience and a successful project history, we are confident in our ability to provide comprehensive material solutions. These solutions effectively tackle the challenges manufacturers face. To explore our full product catalog, simply click here. Our dedicated team is ready to assist with: Moreover, Prostech ensures the safe and accurate global delivery of all materials, including “dangerous goods”, in compliance with legal regulations. For personalized technical support or to receive a quotation, please contact us today.About Prostech
PROPERTY | S-putty2-s | TEST METHOD | UNIT |
Color | Blue | Visual | – |
Resin base | Silicone | – | – |
Viscosity | 3500 | DIN 53018 | Pa.s |
Density | 3.3 | ASTM D792 | g/cm³ |
Application temperature | -60~180 | – | °C |
Bond line thickness | 100~1500 | – | μm |
Shelf life | 60 months | – | – |
ROHS & REACH | Compliant | – | – |
ELECTRICAL | |||
Dielectric breakdown | 12 | ASTM D149 | KV/mm |
Volume resistivity | >10¹³ | ASTM D257 | Ohm-m |
THERMAL | |||
Thermal conductivity | 6.0 | ASTM D5470 | W/m*K |
Thermal impedance@10psi | 0.062 | ASTM D5470 | °C-in²/ W |
Thermal impedance@30psi | 0.059 | ASTM D5470 | °C-in²/ W |
Thermal impedance@50psi | 0.053 | ASTM D5470 | °C-in²/ W |
