Product description
LiPOLY PK223 Thermal Conductive Gel Pad is a soft thermally conductive gap filler. With a thermal conductivity of 2.0 W/m*K and a low thermal impedance, PK223 is suitable for a wide range of applications. This product can be supplied as standard sheets, custom die-cuts, or custom molded parts, making it suitable for various uses. PK223 is also UL 94V-0 approved and compliant with REACH and RoHS standards.
Features of LiPOLY PK223 Thermal Conductive Gel Pad
- Thermal conductivity: 2.0 W/m*K
- Naturally tacky for ease of manufacture
- Low thermal impedance
- Available in a range of thicknesses
Applications of LiPOLY PK223 Thermal Conductive Gel Pad
- Notebook computers
- Heat pipe assemblies
- Memory modules
- TV hardware
- Automotive electronics
- Mobile devices
- High speed mass storage drives
- Set-top box
- IP CAM
- 5G base station & infrastructure
- EV electric vehicle
Prostech offers specialty materials (adhesives, tapes, thermal interface materials, insulating materials, sealants, PCB protection materials, …) along with manufacturing solutions. We proudly serve a wide range of industries and are an authorized distributor for leading global manufacturers of industrial materials and equipment. Our product range is designed to deliver customized solutions that address each customer’s unique needs. With years of experience and a successful project history, we are confident in our ability to provide comprehensive material solutions. These solutions effectively tackle the challenges manufacturers face. To explore our full product catalog, simply click here. Our dedicated team is ready to assist with: Moreover, Prostech ensures the safe and accurate global delivery of all materials, including “dangerous goods”, in compliance with legal regulations. For personalized technical support or to receive a quotation, please contact us today.About Prostech
Property | Value | Test Method | Unit |
---|---|---|---|
Color | White | Visual | – |
Surface tack (2-side/1-side) | 2 | – | – |
Thickness | Customized | ASTM D374 | mm |
Density | 2.1 | ASTM D792 | g/cm³ |
Hardness | 30 | ASTM D2240 | Shore OO |
Application Temperature | -60 ~ 180 | – | °C |
ROHS & REACH Compliant | Yes | – | – |
Compression @ 1.0 mm | |||
Deflection @10 psi | 33 | ASTM D5470 (modified) | % |
Deflection @20 psi | 38 | ASTM D5470 (modified) | % |
Deflection @30 psi | 42 | ASTM D5470 (modified) | % |
Deflection @40 psi | 45 | ASTM D5470 (modified) | % |
Deflection @50 psi | 48 | ASTM D5470 (modified) | % |
Electrical Properties | |||
Dielectric breakdown | 11 | ASTM D149 | KV/mm |
Surface resistivity | >10¹⁰ | ASTM D257 | Ohm |
Volume resistivity | >10¹⁰ | ASTM D257 | Ohm-m |
Thermal Properties | |||
Thermal Conductivity | 2.0 | ASTM D5470 | W/m*K |
Thermal impedance @ 10 psi | 0.711 | ASTM D5470 | °C-in²/W |
Thermal impedance @ 20 psi | 0.664 | ASTM D5470 | °C-in²/W |
Thermal impedance @ 30 psi | 0.633 | ASTM D5470 | °C-in²/W |
Thermal impedance @ 40 psi | 0.595 | ASTM D5470 | °C-in²/W |
Thermal impedance @ 50 psi | 0.572 | ASTM D5470 | °C-in²/W |