Silicone Thermal Pad

Silicone Thermal Pad or called Silicone Based Gap Fillers are used to fill gaps of 0.1 – 10mm between surfaces and lower thermal resistance by excluding air from the interface, usually between heat-generating components (electronic components such as IC, CPU, MOS, LED) and heat sinks, heat spreaders or other cooling devices.
Our Silicone Thermal Pad and Silicone-Based Gap Filler  products have not only high thermal conductivity but also excellently compressive capacity of approx. 25% – 40% which helps to reduce pressure to electronic components

H48-6 Thermal Conductive Pad

  • Product code: H48-6
  • Manufacturer: T-Global
  • Package size: 0.3-10mm
  • Shelf life: 36 months
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H48-2K Thermal Conductive Pad

  • Product code: H48-2K
  • Manufacturer: T-Global
  • Package size: 0.1-0.3mm
  • Shelf life: 36 months
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H48-2 Thermal Conductive Pad

  • Product code: H48-2
  • Manufacturer: T-Global
  • Package size: 0.3-10mm
  • Shelf life: 36 months
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H48-6S Thermal Conductive Pad

  • Product code: H48-6S
  • Manufacturer: T-Global
  • Package size: 0.23 mm
  • Shelf life: 36 months
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