Thermal Pad

Thermal Pads (also called thermally conductive pads or thermal interface pads) are a preformed square or rectangle of solid material (often silicone-based) commonly used on the underside of the heatsink to aid the conduction of heat away from the component being cooled (such as CPU or another chip) and into the heatsink.
Besides thermal pads and compounds are used to fill air gaps caused by imperfectly flat or smooth surfaces that should be in thermal contact.
OVERVIEW OF THERMAL PAD

JONES 21-745 Thermal Phase Change Material

  • Product code: 21-745-020-0132
  • Manufacturer: Jones Tech
  • Package size: Customizable packaging
  • Shelf life: 12 months
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LIPOLY PK404 Thermal Conductive Gel Pad

  • Product code: PK404
  • Manufacturer: Shiu Li Lipoly
  • Package size: 160.00mm x 160.00mm square
  • Shelf life: 5 years
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LiPOLY PK504 Thermal Conductive Gel Pad

  • Product code: PK504
  • Manufacturer: Shiu Li Lipoly
  • Package size: 160.00mm x 160.00mm
  • Shelf life: 5 years
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LiPOLY PK605 Thermal Conductive Gel Pad

  • Product code: PK605
  • Manufacturer: Shiu Li Lipoly
  • Package size: 160.00mm x 160.00mm
  • Shelf life: 5 years
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LiPOLY PK700 Thermal Conductive Gel Pad

  • Product code: PK700
  • Manufacturer: Shiu Li Lipoly
  • Package size: 160.00mm x 160.00mm
  • Shelf life: 5 years
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LiPOLY BS75K Thermal Conductive Gel Pad

  • Product code: BS75K
  • Manufacturer: Shiu Li Lipoly
  • Package size: 320.00mm x 320.00mm
  • Shelf life: 60 months
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LiPOLY BS87-s Thermal Conductive Gel Pad

  • Product code: BS87-s
  • Manufacturer: Shiu Li Lipoly
  • Package size: Customized
  • Shelf life:
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LiPOLY S282-s Thermal Conductive Gel Pad

  • Product code: S282-s
  • Manufacturer: Shiu Li Lipoly
  • Package size: 320.00mm x 320.00mm or customizable
  • Shelf life: Contact us for more details
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LIPOLY N700A Non-Silicone Thermal Conductive Pad

  • Product code: N700A
  • Manufacturer: Shiu Li Lipoly
  • Package size: 160.00mm x 160.00mm
  • Shelf life: Contact us for more details
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