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Home > Products > By Manufacturer > Permabond > PERMABOND® ET5441 – Two-Part Epoxy

PERMABOND® ET5441 – Two-Part Epoxy

  • Product code: ET5441
  • Manufacturer: Permabond
  • Package size:
  • Shelf Life:

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  • Description
  • Specification
  • TDS/MSDS
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PERMABOND® ET5441 is a thixotropic, thermally conductive two-component adhesive based on epoxy resin. It is specifically designed to bond metal substrates when excellent resistance to high temperature is required. The full cure is achieved in 7 days at room temperature, but it can be obtained in 24 hours at room temperature followed by 30 minutes at +80°C (176°F). Permabond ET5441 provides excellent resistance to motor oil, glycol and hot and cold water.

Permabond ET5441 has been specifically formulated to meet the requirements of:
• Flammability rating UL94 HB
• Thermal vacuum outgassing test for the screening of space material ECSS-Q-ST-70-02

Features & Benefits

Full cure at room temperature
Adhesion to a variety of substrates
Thermally conductive
High temperature resistance
Excellent chemical resistance

Physical Properties of Uncured Adhesive

 

  ET5441A ET5441B
Chemical
composition
Epoxy Resin Amine Hardener
Appearance White Dark Grey
Viscosity @ 23°C* 25,000 mPa.s (cP)
Thixo
22,000 mPa.s (cP)
Thixo
Specific gravity 2.1 2.1

Typical Curing Properties

Mix ratio 2:1 by weight
2:1 by volume
Maximum gap fill 2 mm 0.08 in
Usable / pot life @23°C (77°F) 150 minutes
Working strength @23°C (77°F) 8 hours
Full cure 23°C (77°F): 7 days
80°C (176°F): 2 hours

 

Typical Performance of Cured Adhesive

Shear strength*
(ISO4587)
Steel: 20-25 N/mm²
(2900-3625 psi)
Aluminium: 17-21 N/mm²
(2465-3045 psi)
Stainless Steel: 20-25 N/mm²
(2900-3625 psi)
Carbon Fibre: 25-30 N/mm²
(3625-4350 psi)
GRP (Glass/Polyester): >10 N/mm² **
(>1450 psi)
FRP (Glass/Epoxy): >19 N/mm² **
(>2755 psi)
ABS: >6 N/mm² **
(>870 psi)
Polycarbonate: 2-4 N/mm²
(290-580 psi)
Tensile strength at
break (DIN 53504)
50 N/mm² (7250 psi)
Elongation at
Break
2.9%
Hardness (ISO868) 85-95 Shore D
Tg (DSC) 7d @ 23°C 65°C (149°F)
Tg (DSC) 24h@ 23°C
+ 30min @80°C
113°C (235°F)
Coefficient of
thermal expansion
Below Tg: 23 x 10-6 /K
Above Tg: 111 x 10-6 /K
Thermal
Conductivity
(ISO 8302)
1.1 W/(m.K)

TDS:Download

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    PERMABOND® ET5441 – Two-Part Epoxy

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      PERMABOND® ET5441 – Two-Part Epoxy

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        PERMABOND® ET5441 – Two-Part Epoxy

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