PERMABOND® ET5401 is a two-part, 2:1 mixable, semi- flexible toughened no slump epoxy adhesive with good adhesion to a variety of substrates such as wood, metal, ceramics and some plastics and composites. Permabond ET5401 forms tough bonds providing high peel resistance and high shear strength coupled with excellent resistance to high temperatures.
ET5401 performance is enhanced by curing at high temperature or being exposed to high temperature (such as during paint-stoving).\
FEATURES AND BENEFITS
- Adhesion to a wide variety of substrates
- Full cure at room temperature
- Easy to apply
- High shear and peel strength
- Good impact strength
- High temperature resistance
- Non-drip rheology
Physical Properties of Uncured Adhesive
|
|
ET5401A |
ET5401B |
|
Chemical composition |
Epoxy Resin |
Polyamine Hardener |
|
Appearance |
White |
Black |
|
Viscosity @ 25°C |
20rpm: 60,000- 120,000 mPa.s (cP) 2.5rpm: 250,000- 450,000 mPa.s (cP) |
20rpm: 50,000- 100,000 mPa.s (cP) 2.5rpm: 150,000- 250,000 mPa.s (cP) |
|
Specific gravity |
1.2 |
1.1 |
Typical Curing Properties
|
Mix ratio by volume |
2:1 |
|
Maximum gap fill |
5 mm 0.2 in |
|
Usable / pot life @23°C |
10-12 mins |
|
Handling time @23°C (to 1 N/mm²) |
60-90 mins |
|
Working strength @23°C |
24-48 hours |
|
Full cure @23°C |
4-7 days |
Typical Performance of Cured Adhesive
|
Shear strength (grit blasted mild steel)* ISO 4587 Cured 25°C for 7 days |
10-15 N/mm² (1450-2200 psi) |
|
Shear strength ISO 4587 Cured 80°C for 1 hour |
Mild steel 20-30 N/mm² (2900-4400 psi) Aluminium 20-25 N/mm² (2900-3600 psi) FRP Glass Polyester: 6-8 N/mm² (900-1200psi) FRP Glass Epoxy: 19-23 N/mm² (2800-3300psi) Carbon Fibre: 22-24 N/mm² (3200-3500psi) |
|
Peel Strength (aluminium)* Cured 80°C for 1 hour |
140-160 N/25mm (31-35 PIW) |
|
Peel Strength (aluminium)* Cured 200°C for 15 mins |
250-300 N/25mm (55-66 PIW) |
|
Hardness (ISO868) |
65-75 Shore D (cured at 25°C) 75-85 Shore D (cured for 1hr at 80°C) |
|
Elongation at break (ISO37) |
4-8% |
|
Glass transition temperature Tg |
Heat cured: 110°C (230°F) Room temp. cure: 50°C (122°F) |
|
Dielectric strength |
15-25 kV/ mm |
