TSE322SK is a one-component heat-curable silicone adhesive which cures rapidly at elevated temperatures and adheres to a variety of substrates without the use of primers. TSE322SK has high elongation which helps absorb stress.
FEATURES:
- One component product – no mixing required
- Fast cure at elevated temperature
- Primerless adhesion to many types of substrates
- High elongation
- Non-corrosive to metals and sensitive substrates
- Excellent dielectric properties
APPLICATIONS:
- Automotive Electronics Bonding/ Assembly
- Sealing and component fixing
Uncured Properties | ||
Appearance | Semi-flowable, white | |
Viscosity (23 °C) | Pa·s | 220 |
Cured Properties (cured 1 hour at 150 °C) | ||
Density (23 °C) | g/cm³ | 1.24 |
Hardness (Type A) | 25 | |
Elongation | % | 440 |
Tensile Strength | MPa | 3.2 |
Adhesion Strength | MPa | 1.8 |
Dielectric Strength | kV/mm | 2.6 |
Dielectric Constant (60Hz) | 2.9 |