TIA241GF is a 2-component, thermally conductive silicone material that is dispensed as a liquid and cured in place to create a heat path for efficient heat transfer. After being applied, its non-slumping pasty consistency provides physical stability to prevent run-off after dispense. TIA241GF can be used as a liquid dispensed alternative to pre-fabricated Thermal Pads, and as a Gap Filler for a broad array of thermal designs in electronic components.
FEATURES:
- Good thermal conductivity
- Fast, low-temperature cure
- Retains softness after cure to contribute to stress relief during thermal cycling
- Easy to use 1:1 mixing ratio
- Conforms to complex shapes of 3-dimensional interface designs
- Repairable
- Flame retardant: UL94V-0 equivalent
| Uncured Properties | |
| Appearance | TIA241GF (A): Blue TIA241GF (B): Pale blue |
| Viscosity [Pas] | TIA241GF (A): 250 TIA241GF (B): 120 |
| Mix ratio by weight | 1:1 |
| Pot Life | 2h |
| Viscosity after mix | 130 |
| Cure condition 100C | 0.5 |
| Cure condition 23C | 24 |
| Elongation (%) | 40 |
| Volume resistance | 30 (BLT : 80μm) |
