BERGQUIST® TGR 4000 - Thermal Interface Compound for Copper-Based Heat Sinks

BERGQUIST® TGR 4000 is a thermally conductive grease compound designed for use as a thermal interface material between a computer processor and a copper-based heat sink. Other high watt density applications will benefit from the extremely low thermal impedance of BERGQUIST® TGR 4000.

FEATURES:

• Thermal conductivity: 4.0 W/m-K
• Exceptional thermal performance:
0.19°C/W (at 50 psi)

APPLICATIONS:

• High performance computer processors (traditional screw fastening or clamping methods will provide adequate force to optimize the thermal performance of BERGQUIST® TGR 4000)
• High watt density applications where the lowest thermal resistance interface is required

Property	Values
Color	Grey
Density (g/cc)	4.0
Continuous Use Temp. (°F) / (°C)	150
Electrical Resistivity (Ω-m)(1)	N/A
Thermal Conductivity (W/m-K)	4.0

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Differences between Silicone-based and Non-silicone Thermal Interface Materials (TIMs)?

https://prostech.vn/differences-between-silicone-based-and-non-silicone-tims/

Thermal interface materials – TIMsSilicone-based thermal interface materialsPros of silicone-based thermal interface materialsCons of silicone-based thermal interface materialsNon-silicone thermal interface