LOCTITE ABLESTIK ATB 120U, Rubberized Epoxy, Die Attach
LOCTITE® ABLESTIK ATB 120U adhesive film is formulated for use in wafer lamination processes. It combines process ease with the proven reliability.
These adhesive film should be stored at 5ºC, in its original moisture resistant packaging. Partially used reels should be stored under dry conditions at 5ºC
FEATURES OF ATB 120U
- Non-conductive
- Fast cure
- Thin bondline
- Excellent gap filling ability
- L2/260°C performance
Prostech offers specialty materials (adhesives, tapes, thermal interface materials, insulating materials, sealants, PCB protection materials, …) along with manufacturing solutions. We proudly serve a wide range of industries and are an authorized distributor for leading global manufacturers of industrial materials and equipment. Our product range is designed to deliver customized solutions that address each customer’s unique needs. With years of experience and a successful project history, we are confident in our ability to provide comprehensive material solutions. These solutions effectively tackle the challenges manufacturers face. To explore our full product catalog, simply click here. Our dedicated team is ready to assist with: Moreover, Prostech ensures the safe and accurate global delivery of all materials, including “dangerous goods”, in compliance with legal regulations. For personalized technical support or to receive a quotation, please contact us today.About Prostech
| Wafer Backside Lamination | |
Temperature, °C Pressure, psi Taping Duration, ft/ minute | 65 to 70 40 1 |
| Chip Attach | |
Temperature, °C Pressure, kg-f Attach Duration, second | 100 to 120 0.5 to 2 1 to 2 |
| Glass Transition Temperature (Tg) by TMA, °C | 75 |
| Thermal Conductivity , W/(m-K) | 0.21 |