Product code: LOCTITE 3611

Manufacturer: Henkel

Package size: 300 ml

Shelf Life:

LOCTITE 3611, Epoxy, Fast cure, Low moisture absorption, Surface mount adhesive
LOCTITE® 3611 is designed for bonding of surface mounted devices to printed circuit boards prior to wave soldering. Particularly suited where very fast cure is required on high speed SMT lines. The very low moisture absorption allows longer exposure to humidity in open baths, without affecting dispensability or causing void formation in the cured adhesive.

  • One component – requires no mixing
  • Very high wet strength
Cure Schedule Temperature (Step 1) 150
Cure Schedule Temperature Unit (Step 1) °F
Cure Schedule Time (Step 1) 90 – 120
Cure Schedule Time Unit (Step 1) sec.
Cure Type Heat Cure
Number of Components 1 Part
Physical Form Gel
Shear Strength Unit, Grit Blasted Steel psi
Shear Strength, Grit Blasted Steel 2175
Storage Temperature 35.6 – 46.4 °F
Technology Epoxy
Viscosity 20 – 50 Pa∙s

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