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Liquid Dispense Gap Fillers Silcool TIA223G-DG

  • Product code: TIA223G-DG
  • Manufacturer: Momentive
  • Package size:
  • Shelf Life:
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TIA223G-DG is a 2-component, thermally conductive material for encapsulating, gap filling, and for use as a thermal path to heat sinks. The flowability of TIA223G-DG allows it to conform to complex 3-dimensional shapes and cavities in potting applications, while also enabling it to be transferred in a thin layer as a liquid-dispensed alternative to thermal pads.
TIA223G-DG quickly cures to a soft rubber gel with exposure to heat and will also cure at room temperatures.

KEY FEATURES
• Good thermal conductivity
• Fast cure with exposure to heat
• Easy to use 1:1 mixing ratio by weight or volume

APPLICATIONS
Thermal encapsulating, gap filling, and thermal interface to heat sinks in various electronic
components.

 

Đặc điểm Gía trị 
Tỷ lệ trộn 1:1
Màu Xám đậm 
Điều kiện khô đề xuất 0.5h @ 70°C
24h @ RT
Độ nhớt
[Pas]		 40
Thời gian thao tác @RT [h] 0.5
Độ cứng [Thước A] 20
T/C
[Wm/K]		 2.1
Độ bền điện môi
[kV/mm]		 20
Nhiệt độ hoạt động -40°C to 200°C

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