LIPOLY N800AH-s Non-Silicone Thermal Conductive Pad is made of non-silicon resin material. No low molecular siloxane volatilization and low total volatile gas, no electrical contact & pollution problems. N800AH-s is flexible and has great thermal conduction, Low compressive stress and high compressive characteristics can effectively reduce the stress load of components, so that the equipment only needs to bear less mechanical stress, and at the same time, it can have low thermal resistance and high thermal conductivity.
FEATURE of LIPOLY N800AH-s Non-Silicone Thermal Conductive Pad
- Thermal conductivity:7.0 W/m*K
- It’s made by non-silicone resin materials
- Low contact thermal resistance
- With electrical insulation
- Outstanding thermal conductivity
- Applicable to optical and sensitive electric components
APPLICATION of LIPOLY N800AH-s Non-Silicone Thermal Conductive Pad
- HDDS
- Optical appliance
- 5G base station & infrastructure
- EV electric vehicle
About Prostech
Prostech offers specialty materials (adhesives, tapes, thermal interface materials, insulating materials, sealants, PCB protection materials, …) along with manufacturing solutions. We proudly serve a wide range of industries and are an authorized distributor for leading global manufacturers of industrial materials and equipment. Our product range is designed to deliver customized solutions that address each customer’s unique needs.
With years of experience and a successful project history, we are confident in our ability to provide comprehensive material solutions. These solutions effectively tackle the challenges manufacturers face. To explore our full product catalog, simply click here. Our dedicated team is ready to assist with:
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PROPERTY | N800AH-s | TEST METHOD | UNIT |
Color | Pink | Visual | – |
Surface tack 2-side/1-side | 2 | – | – |
Thickness | Customized | ASTM D374 | mm |
Density | 3.3 | ASTM D792 | g/cm³ |
Hardness | 60 | ASTM D2240 | Shore OO |
Tensile Strength | 0.15 | ASTM D412 | Kgf/cm² |
Application temperature | -60~125 | – | °C |
Low molecular Siloxane (D3 to D20 total) | N.D | Gas Chromatography | % |
Outgassing CVCM (wt%) | 0.0057 | By LiPOLY | – |
ROHS & REACH | Compliant | – | – |
COMPRESSION@1.0mm | |||
Deflection @10 psi | 15 | ASTM D5470 modify | % |
Deflection @20 psi | 40 | ASTM D5470 modify | % |
Deflection @30 psi | 67 | ASTM D5470 modify | % |
ELECTRICAL | |||
Dielectric breakdown | 8 | ASTM D149 | KV/mm |
Surface resistivity | >10¹¹ | ASTM D257 | Ohm |
Volume resistivity | >10¹⁰ | ASTM D257 | Ohm-m |
THERMAL | |||
Thermal Conductivity | 7.0 | ASTM D5470 | W/m*K |
Thermal impedance@10 psi | 0.274 | ASTM D5470 | °C-in²/ W |
Thermal impedance@20 psi | 0.182 | ASTM D5470 | °C-in²/ W |
Thermal impedance@30 psi | 0.121 | ASTM D5470 | °C-in²/ W |