Constant quality and premium wetting properties are the characteristics that are typical for Almit Solder Pastes. Only the best and purest materials with uniform particle sizes are processed. This ensures that the features of the paste are always uniform, thus guaranteeing that always the same amount is applied to the stencil plate without having to readjust the stencil printer. The unique patented paste composition efficiently eliminates the problem of paste sticking in the plate apertures, even in fine and superfine pitch below 0.5 mm structures. In the presence of shear forces, the paste demonstrates exceptionally low-friction properties, comparable to those of graphite. Thanks to the paste”s strong thixotropic properties, it retains its precise form after the stencil plate is lifted off after the print. Nevertheless, the solder paste displays sufficient adhesiveness for the components to be adequately retained on the pads, even with the strong acceleration forces that are generated by some of the fastest placement machines acting on them.
FEATURES:
- Fusion point 171 – 181°C
- Low melting solder paste
- Particle sizes 25-45µm
- No Flux inside
- For CSP/BGA
- Available in 500g cans
| Fusion point | 171 – 181°C |
| Particle sizes | 25-45µm |
| Flux Agent | Not included |
