L37-3L Thermal Conductive Pad

L37-3L is a silicone based thermal gap filler which has been formulated for exceptionally low silicone bleed. This allows the product to be used in certain low silicone critical applications, such as optical devices, HDDs and high end communication devices. L37-3L can be provided in a number of different formats including standard sheets, log-rolls and custom die cuts of various thicknesses. L37-3L can also be provided with one or two sided adhesive for ease of manufacture.

FEATURES

• One side natural tack with smooth surface and one exceptionally durable
• High dielectric breakdown voltage

APPLICATIONS

• Electronic components: IC, CPU, MOS
• LED, M/B, P/S, Heat Sink
• LCD TV, Notebook PC, PC Telecom Device, Wireless Hub, etc.
• DDR II Module, DVD Applications, Hand-set applications, etc.