PRODUCT DESCRIPTION
JONES Thermal Pad 21-881 is an ultra soft putty like gap filling material rated at a thermal conductivity of 8.0 W/m-K. It is conformable to uneven and rough surfaces, where require excellent compressibility to the thermal gap filler. Its soft construction offers high conformability and imparts minimum pressure to electronic components.
FEATURES of JONES Thermal Pad 21-881
- Thermal Conductivity: 8.0W/m·K
- Ultra Soft (Putty Like)
- Extremely Good Thermal Performance
- Excellent Surface Wetting
- High Breakdown Voltage
- Easy For Installation
APPLICATIONS of JONES Thermal Pad 21-881
- Memory Modules
- Mass Storage Devices
- Automotive Electronics
- Telecommunication Hardware
- Radios
- Audio And Video Players
- IT Infrastructure
About Prostech
Prostech offers specialty materials (adhesives, tapes, thermal interface materials, insulating materials, sealants, PCB protection materials, …) along with manufacturing solutions. We proudly serve a wide range of industries and are an authorized distributor for leading global manufacturers of industrial materials and equipment. Our product range is designed to deliver customized solutions that address each customer’s unique needs.
With years of experience and a successful project history, we are confident in our ability to provide comprehensive material solutions. These solutions effectively tackle the challenges manufacturers face. To explore our full product catalog, simply click here. Our dedicated team is ready to assist with:
- Provide quotation, sample, TDS/MSDS, and technical consultation
- Testing sample quality and verifying product compatibility in our laboratory
- Customizing material formulas for special applications
- Adapting product sizes, quantities, and packaging to meet specific needs
- Offering expert advice on suitable equipment and automation processes
- Delivering technical training and on-site support for optimal product use
Moreover, Prostech ensures the safe and accurate global delivery of all materials, including “dangerous goods”, in compliance with legal regulations. For personalized technical support or to receive a quotation, please contact us today.
|
Properties |
Thermal Pad 21-881 |
Test Method |
|
|
Thermal |
Thermal Conductivity (W/m·K) |
8.0 |
ASTM D5470 |
|
Operating Temperature Range(℃) |
-55~150 |
JONES Test Method |
|
|
Physical |
Color |
Blue |
Visual |
|
Composition |
Ceramic&Silicone |
– |
|
|
Density (g/cm^3) |
3.2 |
ASTM D792 |
|
|
Thickness Range (mm) |
1.0~5.0 |
ASTM D374 |
|
|
Thickness Tolerance(mm)> 1mm |
±10% |
– |
|
|
Hardness (Shore 00) |
50 |
ASTM D2240 |
|
|
Electrical |
Breakdown Voltage (KV AC/mm) |
>5 |
ASTM D149 |
|
Volume Resistivity (Ohm·cm) |
10^13 |
ASTM D257 |
|
|
Dielectric Constant@1MHz |
6.6 |
ASTM D150 |
|
|
Regulatory |
Flame Rating |
V0 |
UL 94 |
