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JONES Thermal PAD 21-233-SP01-150-0132 Prostech Vietnam

JONES Thermal PAD 21-233-SP01-150-0132

  • Product code: 21-233-SP01-150-0132
  • Manufacturer: Jones Tech
  • Package size: 4” X 4” (100mm X 100mm)
  • Shelf Life: 12 months

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JONES Thermal Pad 21-233-SP01 is designed to provide good thermal performance and adhesion or natural tack.It demonstrates highly conformable to uneven and rough surfaces with minimal thermal gap filler compression. JONES Thermal Pad 21-233-SP01 is available in custom die-cut parts, sheets and rolls, which makes it easy handling and simplified application. It’s also available in a variety of thicknesses and hardness.

FEATURE

  • Thermal Conductivity :3.0W/m·K
  • Single-Side Sticky
  • Very Good Thermal Performance
  • Good Compressibility and Elasticity
  • Tiny Outgassing
  • Easy For Installation

APPLICATION

  • Memory Modules
  • Mass Storage Devices
  • Automotive Electronics
  • Telecommunication Hardware
  • Radios
  • Power Electronics
  • Smartphone Industry

Properties

Thermal Pad 21-233-SP01

Test Method

 

Thermal

Thermal Conductivity (W/m·K)

3.0

ASTM D5470

Operating Temperature Range (°C)

-55~200

JONES Test Method

 

 

 

 

 

Physical

Color

Light Blue

Visual

Composition

Ceramic & Silicone

–

Density (g/cm^3)

3.0

ASTM D792

Thickness Range (mm)

0.5~5.0

ASTM D374

Thickness Tolerance(mm)> 1mm

±10%

–

Thickness Tolerance(mm)</= 1mm

±0.1mm

–

Hardness (Shore 00)

25

ASTM D2240

 

Electrical

Breakdown Voltage (KV AC/mm)

>5

ASTM D149

Volume Resistivity (Ohm·cm)

10^13

ASTM D257

Dielectric Constant@1MHz

5.0

ASTM D150

Regulatory

Flame Rating

V0

UL 94

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