JONES 21-881 Ultra Soft Thermal Pads

JONES Thermal Pad 21-881 is an ultra soft putty like gap filling material rated at a thermal conductivity of 8.0 W/m-K. It is conformable to uneven and rough surfaces, where require excellent compressibility to the thermal gap filler.Its soft construction offers high conformability and imparts minimum pressure to electronic components.

FEATURES AND BENEFITS

Thermal Conductivity :8.0W/m·K
Ultra Soft (Putty Like) ｜Extremely Good
Thermal Performance｜Excellent Surface
Thermal Performance｜Excellent Surface

APPLICATION

Memory Modules｜ Mass Storage Devices｜

Automotive Electronics｜Telecommunication

Hardware｜Radios｜Audio And Video Players｜ IT Infrastructure

21-881 TYPICAL PROPERTIES
	Properties	Typical Properties	Test Method
Thermal	Thermal Conductivity (W/m·K)	8.0	ASTM D5470
Thermal	Operating Temperature Range (°C)	-55~150	JONES Test Method
Physical	Color	Blue	Visual
	Composition	Ceramic&Silicone	/
	Density (g/cm^3)	3.2	ASTM D792
	Thickness Range (mm)	1.0~5.0	ASTM D374
	Thickness Tolerance(mm)> 1mm	±10%	/
	Hardness (Shore 00)	50	ASTM D2240
Electrical	Breakdown Voltage (KV AC/mm)	>5	ASTM D149
	Volume Resistivity (Ohm·cm)	10^13	ASTM D257
	Dielectric Constant@1MHz	6.6	ASTM D150
Regulatory	Flame Rating	V0	UL94

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