JONES 21-870 Ultra Soft Thermal Pads

Product code: 21-870
Manufacturer: Jones Tech
Package size: 4” X 8” (100mm X 200mm)
Shelf Life: 12 months

JONES Thermal Pad 21-870 is an ultra soft putty like gap filling material rated at a thermal conductivity of 7.0 W/m·K. It is conformable to uneven and rough surfaces, where require excellent compressibility to the thermal gap filler.Its soft construction offers high conformability and imparts minimum pressure to electronic components.

FEATURES AND BENEFITS

Thermal Conductivity :7.0W/m·K
Extremely Good Thermal Performance
Excellent Surface Wetting
High Breakdown Voltage
High Breakdown Voltage

APPLICATIONS

Memory Modules｜ Mass Storage Devices｜
Telecommunication Hardware｜Radios｜
Automotive Electronics

21-870 TYPICAL PROPERTIES
	Properties	Typical Properties	Test Method
Thermal	Thermal Conductivity (W/m·K)	7.0	ASTM D5470
Thermal	Operating Temperature Range (°C)	-55~150	JONES Test Method
Physical	Color	Gray	Visual
	Composition	Ceramic&Silicone	/
	Density (g/cm^3)	2.5	ASTM D792
	Thickness Range (mm)	1.0~5.0	ASTM D374
	Thickness Tolerance(mm)> 1mm	±10%	/
	Hardness (Shore 00)	20	ASTM D2240
Electrical	Breakdown Voltage (KV AC/mm)	>1.5	ASTM D149
	Volume Resistivity (Ohm·cm)	10^11	ASTM D257
	Dielectric Constant@1MHz	6.9	ASTM D150
Regulatory	Flame Rating	V0	UL94

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