JONES Thermal Grease 21-430 is a silicone based, high performance thermal interface material. It is designed to perform high thermal conductivity between high watt density chips like CPUs, GPUs, ASIC, Northbridge chipsets and heat sink. It demonstrates outstanding thermal performance and high reliability while wetting out the thermal interfaces under assembly pressure.
FEATURES AND BENEFITS
Thermal Conductivity: 3.3W/m·k｜ Moderate Viscosity For Easy Application｜ No post “Cure” required｜High Thermal Conductivity｜No Dry Out @150°C｜ Solvent-free.
APPLICATIONS
CPUs (Notebooks, PCs, Servers)｜LED Solid State Lighting｜GPUs｜Northbridge Chipsets｜ASICS Chips.
21-430 TYPICAL PROPERTIES | |||
| Properties | Typical Properties | Test Method |
Thermal | Thermal Conductivity(W/m·K) | 3.3 | ASTM D5470 |
Thermal Resistance@40psi (cm^2°C/W） | 0.119 | ASTM D5470 | |
Operating Temperature Range (°C) | -40~125 | JONES Test Method | |
Physical | Composition | Ceramic&Silicone | / |
Color | Grey | Visual | |
Typical Minimum Bondline Thickness (μm) | 50 | JONES Test Method | |
Viscosity@20rpm (Pa·s) | 350 | ASTM D2196 | |
Density (g/cm^3) | 2.4 | ASTM D792 | |
Electrical | Breakdown Voltage (KV AC/mm) | >5.0 | ASTM D149 |
Volume Resistivity@1MHz | 10^13 | ASTM D257 | |
Dielectric Constan(Ohm·cm) | 5.3 | ASTM D150 | |
Regulatory | Flame Rating | V0 | UL94 |
