JONES 21-420 Thermal Grease

JONES Thermal Grease 21-420 is a silicone based, high performance thermal interface material. It is designed to perform high thermal conductivitybetween high watt density chips like CPUs, GPUs, ASIC, Northbridge chipsets and heat sink. It demonstrates outstanding thermal performance and high reliabilitywhile wetting out the thermal interfaces under assembly pressure.

FEATURES AND BENEFITS

Thermal Conductivity:2W/m·k｜Low Thermal Resistance｜Moderate Viscosity｜Solvent-free｜ No post “Cure” required｜Low Bondlines Thickness.

APPLICATIONS

CPUs (Notebooks, PCs, Servers)｜LED Solid State Lighting｜GPUs｜Northbridge Chipsets｜ASICS Chips.

21-420 TYPICAL PROPERTIES
	Properties	Typical Properties	Test Method
Thermal	Thermal Conductivity (W/m·K)	2.0	ASTM D5470
	Thermal Resistance@40psi (°C.cm^2/W）	0.138	ASTM D5470
	Operating Temperature Range (°C)	-40~125	JONES Test Method
Physical	Composition	Metal&Ceramic&Silicon	/
	Color	Grey	Visual
	Typical Minimum Bondline Thickness(μm)	30	JONES Test Method
	Viscosity@20rpm (Pa·s)	100	ASTM D2196
	Density (g/cm^3)	2.1	ASTM D792
Electrical	Dielectric Constan@1MHz	8.0	ASTM D150
Electrical	Volume Resistivity(Ohm·cm)	10^12	ASTM D257
Regulatory	Flame Rating	V0	UL94

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