JONES Thermal Grease 21-420 is a silicone based, high performance thermal interface material. It is designed to perform high thermal conductivitybetween high watt density chips like CPUs, GPUs, ASIC, Northbridge chipsets and heat sink. It demonstrates outstanding thermal performance and high reliabilitywhile wetting out the thermal interfaces under assembly pressure.
FEATURES AND BENEFITS
Thermal Conductivity:2W/m·k｜Low Thermal Resistance｜Moderate Viscosity｜Solvent-free｜ No post “Cure” required｜Low Bondlines Thickness.
APPLICATIONS
CPUs (Notebooks, PCs, Servers)｜LED Solid State Lighting｜GPUs｜Northbridge Chipsets｜ASICS Chips.
21-420 TYPICAL PROPERTIES | |||
| Properties | Typical Properties | Test Method |
Thermal | Thermal Conductivity (W/m·K) | 2.0 | ASTM D5470 |
Thermal Resistance@40psi (°C.cm^2/W） | 0.138 | ASTM D5470 | |
Operating Temperature Range (°C) | -40~125 | JONES Test Method | |
Physical | Composition | Metal&Ceramic&Silicon | / |
Color | Grey | Visual | |
Typical Minimum Bondline Thickness(μm) | 30 | JONES Test Method | |
Viscosity@20rpm (Pa·s) | 100 | ASTM D2196 | |
Density (g/cm^3) | 2.1 | ASTM D792 | |
Electrical | Dielectric Constan@1MHz | 8.0 | ASTM D150 |
Volume Resistivity(Ohm·cm) | 10^12 | ASTM D257 | |
Regulatory | Flame Rating | V0 | UL94 |
