JONES 21-390 is a soft, single part, silicone putty thermal gap filler no cure is required. This gap filler is designed to be used in where large gap tolerances are present and low mechanical stress on delicate components are needed. It is ideal for filling variable gaps between multiple components and a common heat sink.
FEATURES AND BENEFITS
Thermal Conductivity: 9.0 W/m·k｜High Reliability｜Easily Dispensable｜Pre-Cured｜ Electrically Isolating｜Low Thermal Resistance
APPLICATIONS OF JONES 21-390
Cooling components to chassis, frame, or other mating components｜Memory modules｜Mass storage devices｜Automotive electronics Telecommunication hardware｜Power electronics｜LCD and PDP Gat panel｜Audio and video component｜IT infrastructure｜GPS navigation and other portable devices.
ABOUT PROSTECH
Prostech provides specialized manufacturing and bonding solutions for a wide range of industries, serving as an authorized distributor of leading global manufacturers of industrial materials and equipment. Our product range is focused and in-depth, with the aim of delivering “customized” solutions tailored to each customer’s specific applications and needs. Browse our full selection of products here.
Our dedicated technical team is always ready to assist our customers in:
- Testing sample quality and verifying product compatibility in our laboratory
- Providing expert advice on suitable equipment and automation processes
- Customizing material formulas to meet special application requirements
- Customizing product sizes, quantities, and packaging according to customer needs
- Offering technical training and on-site support to ensure optimal use of our products
Prostech ensure the safe and acurrate delivery of all types of materials, including “dangerous goods,” in compliance with legal regulations.
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