JONES Thermal Pad 21-250 is designed to provide excellent performance and adhesion or natural tack.It demonstrates highly conformable to uneven and rough surfaces with minimal thermal gap filler compression.
FEATURES AND BENEFITS
- Thermal Conductivity :5.0W/m·K
- Extremely Good Thermal Performance
- Very Good Compressibility
- High Breakdown Voltage
- Easy For Installation
APPLICATION
- Memory Modules｜ Mass Storage Devices｜
- Automotive Electronics｜ Telecommunication
- Hardware｜Radios｜Power Electronics
21-250 TYPICAL PROPERTIES | |||
| Properties | Typical Properties | Test Method |
Thermal | Thermal Conductivity (W/m·K) | 5.0 | ASTM D5470 |
Operating Temperature Range (°C) | -55~200 | JONES Test Method | |
Physical | Color | Grey | Visual |
Composition | Ceramic&Silicone | / | |
Density (g/cm^3) | 2.8 | ASTM D792 | |
Thickness Range (mm) | 0.5~5.0 | ASTM D374 | |
Thickness Tolerance(mm)> 1mm | ±10% | / | |
Thickness Tolerance(mm)</= 1mm | ±0.1 | / | |
Hardness (Shore 00) | 50 | ASTM D2240 | |
Electrical | Breakdown Voltage (KV AC/mm) | >5 | ASTM D149 |
Volume Resistivity (Ohm·cm) | 10^14 | ASTM D257 | |
Dielectric Constant@1MHz | 4.6 | ASTM D150 | |
Regulatory | Flame Rating | V0 | UL94 |
