JONESThermal Pad 21-217 is a soft and conformable material. It is designed to provide good thermal performance and adhesion or natural tack.It demonstrates highly conformable to uneven and rough surfaces with minimal thermal gap filler compression.
FEATURES AND BENEFITS
- Thermal Conductivity :1.7W/m·K
- Cost-Effective Solution
- Higher Breakdown Voltage
- Ultra Thin (fiber-enhanced)
- Easy For Installation
APPLICATIONS
- Memory Modules｜ Mass Storage Devices｜
- Automotive Electronics｜Telecommunication
- Hardware｜Radios｜Power Electronics｜
- Set-Top Boxes
21-217 TYPICAL PROPERTIES | |||
| Properties | Typical Properties | Test Method |
Thermal | Thermal Conductivity (W/m·K) | 1.7 | ASTM D5470 |
Operating Temperature Range (°C) | -55~200 | JONES Test Method | |
Physical | Color | Black | Visual |
Composition | Ceramic & Silicone | / | |
Density (g/cm^3) | 2.6 | ASTM D792 | |
Thickness Range (mm) | 0.5~5.0 | ASTM D374 | |
Thickness Tolerance(mm)> 1mm | ±10% | / | |
Thickness Tolerance(mm)</= 1mm | ±0.1 | / | |
Hardness (Shore 00) | 40 | ASTM D2240 | |
Electrical | Breakdown Voltage (KV AC/mm) | >5 | ASTM D149 |
Volume Resistivity (Ohm·cm) | 10^13 | ASTM D257 | |
Dielectric Constant@1MHz | 3.3 | ASTM D150 | |
Regulatory | Flame Rating | V0 | UL94 |
